Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12300559 | Semiconductor packages and methods for manufacturing thereof | Si Hao Vincent Yeo, Chan Lam Cha, Ying Dieh Cheong, Chau Fatt Chiang, Cher Hau Danny Koh +7 more | 2025-05-13 |
| 11217511 | Quad package with conductive clips connected to terminals at upper surface of semiconductor die | Chan Lam Cha, Hoe Jian Chong, Cher Hau Danny Koh, Kim Guan Tan, Mei Yong Wang | 2022-01-04 |
| 10937744 | Semiconductor packages including roughening features | Wern Ken Daryl Wee, Si Hao Vincent Yeo | 2021-03-02 |