Issued Patents All Time
Showing 26–28 of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9219025 | Molded flip-clip semiconductor package | Chee Hong Fang, Mei Chin Ng | 2015-12-22 |
| 8945990 | Chip package and method of forming the same | Holger Torwesten, Manfred Mengel, Stefan Schmid, Soon Lock Goh | 2015-02-03 |
| 8304295 | Method of manufacturing an electronic device with a package locking system | Soon Lock Goh, Chin Wei Tan | 2012-11-06 |