Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11791169 | Dual step laser processing of an encapsulant of a semiconductor chip package | Roslie Saini bin Bakar, Chau Fatt Chiang, Chee Hong Lee, Swee Kah Lee, Yu Shien Leong +2 more | 2023-10-17 |
| 10777536 | Semiconductor package with air cavity | Chau Fatt Chiang, April Coleen Tuazon Bernardez, Junny Abdul Wahid, Roslie Saini bin Bakar, Kon Hoe Chin +8 more | 2020-09-15 |
| 10490470 | Semiconductor package and method for fabricating a semiconductor package | Hock Heng Chong, Sook Woon Chan, Chau Fatt Chiang, Khar Foong Chung, Chee Hong Fang +4 more | 2019-11-26 |