Issued Patents All Time
Showing 26–50 of 69 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10242969 | Semiconductor package comprising a transistor chip module and a driver chip module and a method for fabricating the same | Olaf Hohlfeld, Angela Kessler, Magdalena Hoier | 2019-03-26 |
| 10211158 | Power semiconductor module having a direct copper bonded substrate and an integrated passive component, and an integrated power module | Olaf Hohlfeld, Gottfried Beer, Magdalena Hoier, Georg Meyer-Berg | 2019-02-19 |
| 10211133 | Package with interconnections having different melting temperatures | Andreas Grassmann, Angela Kessler, Ivan Nikitin | 2019-02-19 |
| 10128165 | Package with vertically spaced partially encapsulated contact structures | Wolfram Hable, Andreas Grassmann, Eduard Knauer, Michael Ledutke | 2018-11-13 |
| 10115646 | Semiconductor arrangement, semiconductor system and method of forming a semiconductor arrangement | Edward Fuergut | 2018-10-30 |
| 10090251 | Semiconductor chip having a dense arrangement of contact terminals | Peter Ossimitz, Gottfried Beer, Andreas Munding | 2018-10-02 |
| 10079195 | Semiconductor chip package comprising laterally extending connectors | Wolfram Hable, Martin Gruber | 2018-09-18 |
| 10002821 | Semiconductor chip package comprising semiconductor chip and leadframe disposed between two substrates | — | 2018-06-19 |
| 9984928 | Method for producing a number of chip assemblies and method for producing a semiconductor arrangement | Olaf Hohlfeld, Gottfried Beer, Edward Fuergut, Peter Kanschat | 2018-05-29 |
| 9978720 | Insulated die | Horst Theuss, Gottfried Beer | 2018-05-22 |
| 9972596 | Chip assemblage, press pack cell and method for operating a press pack cell | Olaf Hohlfeld | 2018-05-15 |
| 9924594 | Power semiconductor module and method for producing a power semiconductor module | Andre Arens, Magdalena Hoier | 2018-03-20 |
| 9818730 | Semiconductor arrangement, method for producing a number of chip assemblies, method for producing a semiconductor arrangement and method for operating a semiconductor arrangement | Gottfried Beer, Irmgard Escher-Poeppel, Olaf Hohlfeld, Peter Kanschat | 2017-11-14 |
| 9748611 | Apparatus for determining a state of a rechargeable battery or of a battery, a rechargeable battery or a battery, and a method for determining a state of a rechargeable battery or of a battery | Klaus Elian, Jochen Dangelmaier, Manfred Fries, Georg Meyer-Berg, Thomas Mueller +3 more | 2017-08-29 |
| 9721863 | Printed circuit board including a leadframe with inserted packaged semiconductor chips | Andreas Grassmann | 2017-08-01 |
| 9672459 | Chip card with integrated active components | Frank Pueschner, Joerg Fischer, Peter Stampka, Markus Tietke, Stefan Troelenberg | 2017-06-06 |
| 9633303 | Smart card module arrangement | Frank Pueschner, Peter Scherl | 2017-04-25 |
| 9620459 | Semiconductor arrangement, method for producing a semiconductor module, method for producing a semiconductor arrangement and method for operating a semiconductor arrangement | Gottfried Beer, Irmgard Escher-Poeppel, Olaf Hohlfeld, Peter Kanschat | 2017-04-11 |
| 9595502 | Spring contact for semiconductor chip | Olaf Hohlfeld, Edward Fuergut, Horst Groeninger | 2017-03-14 |
| 9589859 | Semiconductor arrangement, method for producing a number of chip assemblies and method for producing a semiconductor arrangement | Gottfried Beer, Edward Fuergut, Olaf Hohlfeld, Peter Kanschat | 2017-03-07 |
| 9532459 | Electronic module and method of manufacturing the same | Frank Winter, Ottmar Geitner, Ivan Nikitin | 2016-12-27 |
| 9496237 | Semiconductor device having solderable and bondable electrical contact pads | Gottfried Beer, Raimund Foerg | 2016-11-15 |
| 9349709 | Electronic component with sheet-like redistribution structure | Georg Meyer-Berg | 2016-05-24 |
| 9337155 | Semiconductor component with moisture barrier for sealing semiconductor body | Gottfried Beer, Thilo Stolze | 2016-05-10 |
| 9331059 | Chip, chip package and die | Robert Allinger, Gottfried Beer | 2016-05-03 |