Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11574889 | Power module comprising two substrates and method of manufacturing the same | Wolfram Hable, Andreas Grassmann, Frank Winter, Christian Neugirg, Ivan Nikitin | 2023-02-07 |
| 9847274 | Electronic module and method of manufacturing the same | Frank Winter, Ivan Nikitin, Jürgen Högerl | 2017-12-19 |
| 9589922 | Electronic module and method of manufacturing the same | Christian Neugirg, Andreas Grassmann, Wolfram Hable, Frank Winter, Alexander Schwarz +1 more | 2017-03-07 |
| 9585241 | Substrate, chip arrangement, and method for manufacturing the same | Wolfram Hable, Andreas Grassmann, Frank Winter, Alexander Schwarz, Alexander Herbrandt | 2017-02-28 |
| 9532459 | Electronic module and method of manufacturing the same | Frank Winter, Ivan Nikitin, Juergen Hoegerl | 2016-12-27 |
| 9275926 | Power module with cooling structure on bonding substrate for cooling an attached semiconductor chip | Wolfram Hable, Andreas Grassmann, Frank Winter, Alexander Schwarz, Alexander Herbrandt +2 more | 2016-03-01 |
| 8952521 | Semiconductor packages with integrated antenna and method of forming thereof | Maciej Wojnowski, Walter Hartner, Gottfried Beer, Klaus Pressel, Mehran Pour Mousavi | 2015-02-10 |
| 8669655 | Chip package and a method for manufacturing a chip package | Walter Hartner, Maciej Wojnowski, Ulrich Wachter, Michael Bauer, Andreas Stueckjuergen | 2014-03-11 |
| 7759163 | Semiconductor module | Werner Kroeninger, Josef Schwaiger, Ludwig Schneider, Markus Brunnbauer, Thorsten Meyer +4 more | 2010-07-20 |