JH

Jürgen Högerl

Infineon Technologies Ag: 10 patents #886 of 7,486Top 15%
IA Infineon Technologies Austria Ag: 1 patents #668 of 1,126Top 60%
QA Qimonda Ag: 1 patents #252 of 575Top 45%
📍 Regensburg, DE: #185 of 1,384 inventorsTop 15%
Overall (All Time): #418,858 of 4,157,543Top 15%
12
Patents All Time

Issued Patents All Time

Showing 1–12 of 12 patents

Patent #TitleCo-InventorsDate
9847274 Electronic module and method of manufacturing the same Frank Winter, Ottmar Geitner, Ivan Nikitin 2017-12-19
9385111 Electronic component with electronic chip between redistribution structure and mounting structure Manfred Mengel, Edward Fürgut, Ralf Otremba 2016-07-05
7500305 Placement system for populating a substrate with electronic components Jens Pohl, Uta Sasse, Ingo Wennemuth 2009-03-10
7069647 Method for populating a substrate with electronic components Jens Pohl, Uta Sasse, Ingo Wennemuth 2006-07-04
6960829 Method for producing a semiconductor wafer, semiconductor chip, and intermediate semiconductor product 2005-11-01
6851598 Electronic component with a semiconductor chip and method for producing the electronic component Uta Gebauer, Harry Hedler, Volker Strutz 2005-02-08
6774483 Semiconductor assembly with a semiconductor module Erich Syri 2004-08-10
6737581 Configuration of a plurality of circuit modules 2004-05-18
6665182 Module unit for memory modules and method for its production 2003-12-16
6646333 Semiconductor module having interconnected semiconductor chips disposed one above the other 2003-11-11
6576995 Housing for semiconductor chips Stefan Paulus 2003-06-10
6507106 Semiconductor module with a number of semiconductor chips and a conductive connection between the semiconductor chips by flexible tapes 2003-01-14