Issued Patents All Time
Showing 1–25 of 50 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12355502 | Measurement application device calibration unit, measurement system, method | Florian Ramian | 2025-07-08 |
| 12330243 | Method of forming an intermetallic phase layer with a plurality of nickel particles | Alexander Heinrich, Catharina Wille | 2025-06-17 |
| 12334989 | Radio frequency testing apparatus with voltage standing wave ratio adjustment and corresponding method | Christian Kuhn, Florian Ramian | 2025-06-17 |
| 12277360 | Method and monitoring system for providing signal level performance information | Florian Ramian | 2025-04-15 |
| 12235299 | Measurement system and method of determining a corrected averaged power signal | Gregor Feldhaus, Bernhard Gaede | 2025-02-25 |
| 12237242 | Semiconductor device package comprising a thermal interface material with improved handling properties | Martin Mayer, Edward Fuergut, Karina Rott | 2025-02-25 |
| 12218671 | Phase coherent synthesizer | Juergen Rademacher, Ernst Polz | 2025-02-04 |
| 12119284 | DBC substrate for power semiconductor devices, method for fabricating a DBC substrate and power semiconductor device having a DBC substrate | — | 2024-10-15 |
| 12069802 | Pre-plating of solder layer on solderable elements for diffusion soldering | Alexander Heinrich | 2024-08-20 |
| 12023762 | Layer structure with an intermetallic phase layer and a chip package that includes the layer structure | Alexander Heinrich, Catharina Wille | 2024-07-02 |
| 12028117 | Method as well as test system for testing a device under test | Florian Ramian, Wolfgang Dressel | 2024-07-02 |
| 11936436 | External frontend device and frontend system | Wolfgang Dressel | 2024-03-19 |
| 11804383 | Method for producing a metal-ceramic substrate with electrically conductive vias | — | 2023-10-31 |
| 11626351 | Semiconductor package with barrier to contain thermal interface material | Ivan Nikitin, Timo Bohnenberger, Andreas Grassmann, Martin Mayer, Franz Zollner | 2023-04-11 |
| 11606154 | Wideband spectrum analyzer | — | 2023-03-14 |
| 11557522 | Method for producing power semiconductor module arrangement | Olaf Hohlfeld | 2023-01-17 |
| 11557490 | Method for producing a metal-ceramic substrate with at least one via | — | 2023-01-17 |
| 11552042 | Solder material with two different size nickel particles | Alexander Heinrich, Catharina Wille | 2023-01-10 |
| 11404359 | Leadframe package with isolation layer | Stefan Schwab | 2022-08-02 |
| 11155739 | Resin-impregnated boron nitride body and a method for producing a resin-impregnated boron nitride body | — | 2021-10-26 |
| 11137444 | Measurement device and method of setting a measurement device | Matthias Ruengeler, Florian Ramian, Michael Simon | 2021-10-05 |
| 11081414 | Power semiconductor module arrangement | Olaf Hohlfeld | 2021-08-03 |
| 11050430 | Sampling device | Gregor Feldhaus | 2021-06-29 |
| 10805015 | Method as well as test system for testing a device under test | Wolfgang Dressel, Florian Ramian | 2020-10-13 |
| 10796929 | Method for producing a metal-ceramic substrate with at least one via | — | 2020-10-06 |