Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12347805 | Inkjet printing of diffusion solder | Stefan Schwab, Alexander Heinrich | 2025-07-01 |
| 12330243 | Method of forming an intermetallic phase layer with a plurality of nickel particles | Alexander Heinrich, Alexander Roth | 2025-06-17 |
| 12023762 | Layer structure with an intermetallic phase layer and a chip package that includes the layer structure | Alexander Heinrich, Alexander Roth | 2024-07-02 |
| 11776927 | Semiconductor device including a solder compound containing a compound Sn/Sb | Thomas Behrens, Alexander Heinrich, Evelyn Napetschnig, Bernhard Weidgans, Christina Yeong | 2023-10-03 |
| 11552042 | Solder material with two different size nickel particles | Alexander Heinrich, Alexander Roth | 2023-01-10 |
| 11069644 | Semiconductor device including a solder compound containing a compound Sn/Sb | Thomas Behrens, Alexander Heinrich, Evelyn Napetschnig, Bernhard Weidgans, Christina Yeong | 2021-07-20 |
| 10014275 | Method for producing a chip assemblage | Alexander Heinrich, Irmgard Escher-Poeppel, Martin Gruber, Andreas Munding | 2018-07-03 |