Issued Patents All Time
Showing 26–50 of 71 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11508694 | Chip assembly | — | 2022-11-22 |
| 11450642 | Soldering a conductor to an aluminum metallization | Edmund Riedl, Wu Hu Li, Ralf Otremba, Werner Reiss | 2022-09-20 |
| 11451941 | Position-based access verification method | Franz Heininger, Ulrich Emmerling | 2022-09-20 |
| 11439762 | Data collection apparatus for attachment to an injection device | Maurice Toporek, Matthias Felber, Christoph Matthias Gugl, Marcus-Meinolf Dittrich, Christian Nessel +5 more | 2022-09-13 |
| 11424217 | Soldering a conductor to an aluminum layer | Ralf Otremba, Stefan Schwab | 2022-08-23 |
| 11302668 | Multi-purpose non-linear semiconductor package assembly line | Thorsten Meyer, Gerald Ofner, Stephan Bradl, Stefan Miethaner, Horst Theuss +1 more | 2022-04-12 |
| 11217047 | Method for verifying a predefined maximum spatial distance of a radio key in relation to a motor vehicle, as well as control device, motor vehicle and radio key | Franz Plattner, Stefan Hermann | 2022-01-04 |
| 11192525 | Access arrangement for a vehicle | Ulrich Emmerling, Annette Hebling, Christine Igl, Georg Käufl, Stefan Hermann | 2021-12-07 |
| 11158602 | Batch diffusion soldering and electronic devices produced by batch diffusion soldering | Kirill Trunov, Konrad Roesl, Arthur Unrau | 2021-10-26 |
| 11069644 | Semiconductor device including a solder compound containing a compound Sn/Sb | Thomas Behrens, Evelyn Napetschnig, Bernhard Weidgans, Catharina Wille, Christina Yeong | 2021-07-20 |
| 11004823 | Chip assembly and method of manufacturing thereof | Frank Daeche | 2021-05-11 |
| 10930614 | Chip arrangements | Manfred Mengel, Steffen ORSO, Thomas Behrens, Oliver Eichinger, Lim Fong +2 more | 2021-02-23 |
| 10896893 | Soldering a conductor to an aluminum metallization | Edmund Riedl, Wu Hu Li, Ralf Otremba, Werner Reiss | 2021-01-19 |
| 10892247 | Soldering a conductor to an aluminum metallization | Edmund Riedl, Wu Hu Li, Ralf Otremba, Werner Reiss | 2021-01-12 |
| 10874802 | Data collection apparatus for attachment to an injection device | Maurice Toporek, Matthias Felber, Christoph Matthias Gugl, Marcus-Meinolf Dittrich, Christian Nessel +5 more | 2020-12-29 |
| 10799061 | Beverage preparation machine with single motor actuation | Michael Ayoub, Reto Markus Zurcher, Roland Lehmann, Martin Gadient, Manuel Widmer | 2020-10-13 |
| 10707158 | Package with vertical interconnect between carrier and clip | Bernd Goller, Thorsten Meyer, Gerald Ofner | 2020-07-07 |
| 10636766 | Chip assembly | — | 2020-04-28 |
| 10615145 | Soldering a conductor to an aluminum metallization | Edmund Riedl, Wu Hu Li, Ralf Otremba, Werner Reiss | 2020-04-07 |
| 10566309 | Multi-purpose non-linear semiconductor package assembly line | Thorsten Meyer, Gerald Ofner, Peter Scherl, Stephan Bradl, Stefan Miethaner +1 more | 2020-02-18 |
| 10475761 | Method for producing electronic device with multi-layer contact | Michael Juerss, Konrad Roesl, Oliver Eichinger, Kok Chai Goh, Tobias Schmidt | 2019-11-12 |
| 10262959 | Semiconductor devices and methods of forming thereof | Evelyn Napetschnig, Ulrike Fastner, Thomas Fischer | 2019-04-16 |
| 10192849 | Semiconductor modules with semiconductor dies bonded to a metal foil | Petteri Palm, Holger Torwesten, Tobias Simbeck | 2019-01-29 |
| 10014275 | Method for producing a chip assemblage | Irmgard Escher-Poeppel, Martin Gruber, Andreas Munding, Catharina Wille | 2018-07-03 |
| 9837381 | Method of forming a chip assembly with a die attach liquid | — | 2017-12-05 |