Issued Patents All Time
Showing 51–75 of 203 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9397018 | Chip arrangement, a method for manufacturing a chip arrangement, integrated circuits and a method for manufacturing an integrated circuit | Ralf Otremba, Josef Hoeglauer, Juergen Schredl, Xaver Schloegel, Wolfram Hable +2 more | 2016-07-19 |
| 9385107 | Multichip device including a substrate | Ivan Nikitin, Khalil Hosseini | 2016-07-05 |
| 9379050 | Electronic device | Khalil Hosseini, Frank Kahlmann | 2016-06-28 |
| 9362240 | Electronic device | Khalil Hosseini, Ralf Otremba, Josef Hoeglauer, Juergen Schredl, Xaver Schloegel +1 more | 2016-06-07 |
| 9362191 | Encapsulated semiconductor device | Khalil Hosseini, Ivan Nikitin | 2016-06-07 |
| 9349680 | Chip arrangement and method of manufacturing the same | Peter Strobel, Edward Fuergut | 2016-05-24 |
| 9331060 | Device including two power semiconductor chips and manufacturing thereof | Ralf Otremba, Josef Hoeglauer, Johannes Lodermeyer | 2016-05-03 |
| 9318473 | Semiconductor device including a polymer disposed on a carrier | Khalil Hosseini, Edward Fuergut, Manfred Mengel | 2016-04-19 |
| 9313898 | Low viscosity polymeric printing solutions and electronic components bearing polyimide based upon the low viscosity polymeric printing solutions | Manfred Mengel | 2016-04-12 |
| 9313897 | Method for electrophoretically depositing a film on an electronic assembly | Manfred Mengel, Khalil Hosseini, Franz-Peter Kalz | 2016-04-12 |
| 9305876 | Device including a semiconductor chip and wires | Khalil Hosseini | 2016-04-05 |
| 9263369 | Chip arrangement, wafer arrangement and method of manufacturing the same | Khalil Hosseini, Anton Mauder | 2016-02-16 |
| 9249014 | Packaged nano-structured component and method of making a packaged nano-structured component | Khalil Hosseini, Georg Meyer-Berg | 2016-02-02 |
| 9190389 | Chip package with passives | Georg Meyer-Berg, Khalil Hosseini | 2015-11-17 |
| 9171804 | Method for fabricating an electronic component | Georg Meyer-Berg, Khalil Hosseini, Edward Fuergut | 2015-10-27 |
| 9171787 | Packaged semiconductor device having an embedded system | Khalil Hosseini, Georg Meyer-Berg | 2015-10-27 |
| 9165792 | Integrated circuit, a chip package and a method for manufacturing an integrated circuit | Khalil Hosseini, Anton Mauder | 2015-10-20 |
| 9165847 | Semiconductor device including a material to absorb thermal energy | Ralf Otremba, Khalil Hosseini | 2015-10-20 |
| 9159701 | Method of manufacturing a chip package, chip package, method of manufacturing a chip assembly and chip assembly | Khalil Hosseini, Franz-Peter Kalz, Joachim Voelter, Ralf Wombacher | 2015-10-13 |
| 9147649 | Multi-chip module | Stefan Landau, Thomas Wowra | 2015-09-29 |
| 9142739 | Method and system for providing a reliable light emitting diode semiconductor device | Andreas Eder, Henrik Ewe, Stefan Landau | 2015-09-22 |
| 9123806 | Method of manufacturing a semiconductor device | Edward Fuergut | 2015-09-01 |
| 9123764 | Method of manufacturing a component comprising cutting a carrier | Thomas Behrens, Ivan Nikitin | 2015-09-01 |
| 9123708 | Semiconductor chip package | Khalil Hosseini, Thomas Wowra, Ralf Wombacher | 2015-09-01 |
| 9123687 | Method of manufacturing a semiconductor device | Henrik Ewe, Anton Prueckl | 2015-09-01 |