Issued Patents All Time
Showing 101–125 of 203 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8835219 | Device contact, electric device package and method of manufacturing an electric device package | Khalil Hosseini | 2014-09-16 |
| 8836120 | Semiconductor device with a layer including niobium, and/or tantalum overlying a contact pad or a metal layer | Khalil Hosseini, Manfred Mengel | 2014-09-16 |
| 8824145 | Electric device package and method of making an electric device package | Khalil Hosseini | 2014-09-02 |
| 8815651 | Method for manufacturing an electronic device by reducing thickness of electronic members attached to a carrier | Edward Fuergut | 2014-08-26 |
| 8786111 | Semiconductor packages and methods of formation thereof | Edward Fuergut, Khalil Hosseini, Hans-Joerg Timme | 2014-07-22 |
| 8778733 | Semiconductor package and methods of formation thereof | Edward Fuergut, Khalil Hosseini | 2014-07-15 |
| 8749075 | Integrated circuits and a method for manufacturing an integrated circuit | Lukas Ossowski, Khalil Hosseini, Ivan Nikitin | 2014-06-10 |
| 8749029 | Method of manufacturing a semiconductor device | Edward Fuergut | 2014-06-10 |
| 8728873 | Methods for filling a contact hole in a chip package arrangement and chip package arrangements | Benjamin Alles, Edward Fuergut, Ivan Nikitin | 2014-05-20 |
| 8698298 | Laminate electronic device | Ewe Henrik, Anton Prueckl, Ivan Nikitin | 2014-04-15 |
| 8692361 | Electric device package comprising a laminate and method of making an electric device package comprising a laminate | Edward Fuergut, Khalil Hosseini, Georg Meyer-Berg | 2014-04-08 |
| 8687370 | Housing for a chip arrangement and a method for forming a housing | Stefan Landau | 2014-04-01 |
| 8686569 | Die arrangement and method of forming a die arrangement | Frank Daeche, Anton Prueckl, Stefan Landau, Josef Hoeglauer | 2014-04-01 |
| 8664043 | Method of manufacturing a laminate electronic device including separating a carrier into a plurality of parts | Henrik Ewe, Anton Prueckl, Stefan Landau | 2014-03-04 |
| 8648456 | Embedded integrated circuit package and method for manufacturing an embedded integrated circuit package | Edward Fuergut, Khalil Hosseini, Georg Meyer-Berg | 2014-02-11 |
| 8642408 | Semiconductor device | Ralf Otremba, Bernd Rakow, Reimund Engl, Rupert Fischer | 2014-02-04 |
| 8642389 | Method of manufacturing a semiconductor device | Thomas Wowra, Manfred Mengel | 2014-02-04 |
| 8633600 | Device and method for manufacturing a device | Manfred Mengel, Khalil Hosseini | 2014-01-21 |
| 8618674 | Semiconductor device including a sintered insulation material | Ivan Nikitin | 2013-12-31 |
| 8598694 | Chip-package having a cavity and a manufacturing method thereof | Khalil Hosseini, Anton Prueckl | 2013-12-03 |
| 8581371 | Connection element for a semiconductor component and method for producing the same | Khalil Hosseini, Joachim Krumrey, Gerhard Noebauer | 2013-11-12 |
| 8569109 | Method for attaching a metal surface to a carrier, a method for attaching a chip to a chip carrier, a chip-packaging module and a packaging module | Manfred Mengel, Khalil Hosseini, Horst Theuss | 2013-10-29 |
| 8531014 | Method and system for minimizing carrier stress of a semiconductor device | Manfred Mengel, Oliver Eichinger, Khalil Hosseini | 2013-09-10 |
| 8519547 | Chip arrangement and method for producing a chip arrangement | Alfred Haimerl, Angela Kessler, Michael Bauer | 2013-08-27 |
| 8513062 | Method of manufacturing a semiconductor device with a carrier having a cavity and semiconductor device | Ivan Nikitin | 2013-08-20 |