Issued Patents All Time
Showing 126–150 of 203 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8507080 | Thermoplastic-thermosetting composite and method for bonding a thermoplastic material to a thermosetting material | Alfred Haimerl, Wolfgang Schober, Michael Bauer, Angela Kessler | 2013-08-13 |
| 8450148 | Molding compound adhesion for map-molded flip-chip | Edward Fuergut | 2013-05-28 |
| 8440733 | Semiconductor component and production method | Alfred Haimerl, Michael Bauer, Angela Kessler, Wolfgang Schober | 2013-05-14 |
| 8399996 | Chip carrier | Khalil Hosseini | 2013-03-19 |
| 8362617 | Semiconductor device | Ivan Nikitin | 2013-01-29 |
| 8354299 | Semiconductor component having a stack of semiconductor chips and method for producing the same | Michael Bauer, Thomas Engling, Alfred Haimerl, Angela Kessler, Wolfgang Schober | 2013-01-15 |
| 8350382 | Semiconductor device including electronic component coupled to a backside of a chip | Edward Fürgut, Michael Bauer | 2013-01-08 |
| 8330252 | Integrated circuit device and method for the production thereof | Reimund Engl, Thomas Behrens, Wolfgang Kuebler, Rainald Sander | 2012-12-11 |
| 8304884 | Semiconductor device including spacer element | Ivan Nikitin, Thomas Behrens | 2012-11-06 |
| 8288207 | Method of manufacturing semiconductor devices | Edward Fuergut, Manfred Mengel | 2012-10-16 |
| 8283756 | Electronic component with buffer layer | Ivan Galesic, Alexander Heinrich, Khalil Hosseini | 2012-10-09 |
| 8253241 | Electronic module | Stefan Landau, Erwin Huber, Josef Hoeglauer, Tino Karczeweski | 2012-08-28 |
| 8201326 | Method of manufacturing a semiconductor device | Henrik Ewe, Anton Prueckl | 2012-06-19 |
| 8187964 | Integrated circuit device and method | Thomas Behrens, Ivan Galesic | 2012-05-29 |
| 8178390 | Semiconductor component and production method | Alfred Haimerl, Michael Bauer, Angela Kessler, Wolfgang Schober | 2012-05-15 |
| 8129225 | Method of manufacturing an integrated circuit module | Stefan Landau, Alexander Koenigsberger, Klaus Schiess | 2012-03-06 |
| 8129831 | Chip arrangement and method for producing a chip arrangement | Alfred Haimerl, Michael Bauer | 2012-03-06 |
| 8120158 | Laminate electronic device | Henrik Ewe, Anton Prueckl, Ivan Nikitin | 2012-02-21 |
| 8110912 | Semiconductor device | Manfred Mengel | 2012-02-07 |
| 8110906 | Semiconductor device including isolation layer | Wae Chet Yong, Stanley Job Doraisamy, Gerhard Deml, Rupert Fischer, Reimund Engl | 2012-02-07 |
| 8101463 | Method of manufacturing a semiconductor device | Manfred Mengel, Stefan Landau | 2012-01-24 |
| 8097959 | Semiconductor device including first and second carriers | Stefan Landau, Thomas Wowra | 2012-01-17 |
| 8097944 | Semiconductor device | Stefan Landau, Ralf Otremba, Uwe Kirchner, Andreas Schloegl, Christian Fachmann | 2012-01-17 |
| 8097936 | Component, power component, apparatus, method of manufacturing a component, and method of manufacturing a power semiconductor component | Henrik Ewe | 2012-01-17 |
| 8076003 | Coating composition and a method of coating | Manfred Mengel | 2011-12-13 |