Issued Patents All Time
Showing 176–200 of 203 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7811860 | Method for producing a device and device | Markus Brunnbauer, Manfred Mengel, Christof Matthias Schilz | 2010-10-12 |
| 7795727 | Semiconductor module having discrete components and method for producing the same | Michael Bauer, Alfred Haimerl, Angela Kessler | 2010-09-14 |
| 7781876 | Curing layers of a semiconductor product using electromagnetic fields | Horst Theuss, Manfred Mengel | 2010-08-24 |
| 7781897 | Semiconductor device and method for producing the same | Khalil Hosseini, Eduard Knauer, Peter Mederer, Konrad Roesl | 2010-08-24 |
| 7777352 | Semiconductor device with semiconductor device components embedded in plastic package compound | Seow Mun Tang | 2010-08-17 |
| 7767495 | Method for the fabrication of semiconductor devices including attaching chips to each other with a dielectric material | Edward Fuergut, Carsten von Koblinski, Ivan Nikitin | 2010-08-03 |
| 7768107 | Semiconductor component including semiconductor chip and method for producing the same | Michael Bauer, Alfred Haimerl, Angela Kessler, Wolfgang Schober | 2010-08-03 |
| 7749797 | Semiconductor device having a sensor chip, and method for producing the same | Michael Bauer, Alfred Haimerl, Angela Kessler, Wolfgang Schober | 2010-07-06 |
| 7728053 | Plastic housing composition for embedding semiconductor devices in a plastic housing and use of the plastic housing composition | Michael Bauer, Alfred Haimerl, Angela Kessler, Wolfgang Schober | 2010-06-01 |
| 7728415 | Power semiconductor component stack using lead technology with surface-mountable external contacts and a method for producing the same | Khalil Hosseini, Alexander Koenigsberger, Ralf Otremba, Xaver Schloegel, Klaus Schiess | 2010-06-01 |
| 7714422 | Electronic module with a semiconductor chip and a component housing and methods for producing the same | Michael Bauer, Alfred Haimerl, Angela Kessler, Wolfgang Schober | 2010-05-11 |
| 7709938 | Arrangement for electrically connecting semiconductor circuit arrangements to an external contact device and method for producing the same | Thomas Laska, Matthias Stecher, Gregory Bellynck, Khalil Hosseini | 2010-05-04 |
| 7705436 | Semiconductor device with semiconductor chip and method for producing it | Alfred Haimerl, Angela Kessler, Michael Bauer, Wolfgang Schober | 2010-04-27 |
| 7705472 | Semiconductor device with semiconductor device components embedded in a plastic housing composition | Ralf Wombacher, Dieter Lachman, Bernd Betz, Stefan Paulus, Edmund Riedl | 2010-04-27 |
| 7705441 | Semiconductor module | Reimund Engl, Thomas Behrens | 2010-04-27 |
| 7667337 | Semiconductor device with conductive die attach material | Thomas Behrens, Stefan Landau, Eduard Knauer, Rupert Fischer | 2010-02-23 |
| 7662726 | Integrated circuit device having a gas-phase deposited insulation layer | Henrik Ewe, Manfred Mengel | 2010-02-16 |
| 7645642 | Method of joining a thermoplastic material to a thermoset material, and thermoplastic-thermoset composite | Michael Bauer, Alfred Haimerl, Angela Kessler, Wolfgang Schober | 2010-01-12 |
| 7642641 | Integrated circuit component with passivation layer | Ralf Otremba, Bernd Betz, Khalil Hosseini | 2010-01-05 |
| 7635612 | Method and use of a device for applying coatings to band-like structures during the production of semiconductor components | Bernd Betz, Ralf Otremba, Stefan Paulus | 2009-12-22 |
| 7629660 | Semiconductor sensor component including a sensor chip and methods for the manufacturing thereof | Michael Bauer, Alfred Haimerl, Angela Kessler, Wolfgang Schober | 2009-12-08 |
| 7612457 | Semiconductor device including a stress buffer | Alfred Haimerl, Angela Wieneke Kessler, Michael Bauer | 2009-11-03 |
| 7589403 | Lead structure for a semiconductor component and method for producing the same | Michael Bauer, Angela Kessler, Wolfgang Schober, Alfred Haimerl | 2009-09-15 |
| 7476981 | Electronic module with layer of adhesive and process for producing it | Robert Bergmann | 2009-01-13 |
| 7464603 | Sensor component with a cavity housing and a sensor chip and method for producing the same | Michael Bauer, Angela Kessler, Wolfgang Schober, Alfred Haimerl | 2008-12-16 |