Issued Patents All Time
Showing 76–100 of 203 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9093416 | Chip-package and a method for forming a chip-package | Manfred Mengel, Thomas Wowra, Khalil Hosseini | 2015-07-28 |
| 9082767 | Embedded integrated circuit package and method for manufacturing an embedded integrated circuit package | Edward Fuergut, Khalil Hosseini, Georg Meyer-Berg | 2015-07-14 |
| 9082706 | Semiconductor device with a semiconductor chip and electrical connecting elements to a conductor structure | — | 2015-07-14 |
| 9070568 | Chip package with embedded passive component | Khalil Hosseini, Georg Meyer-Berg | 2015-06-30 |
| 9059155 | Chip package and method for manufacturing the same | Henrik Ewe, Anton Prueckl, Frank Daeche, Josef Hoeglauer, Riccardo Pittassi | 2015-06-16 |
| 9059083 | Semiconductor device | Henrik Ewe, Manfred Mengel, Reimund Engl, Josef Hoeglauer, Jochen Dangelmaier | 2015-06-16 |
| 9054040 | Multi-die package with separate inter-die interconnects | Khalil Hosseini, Josef Höglauer | 2015-06-09 |
| 9048338 | Device including two power semiconductor chips and manufacturing thereof | Khalil Hosseini, Manfred Mengel, Franz-Peter Kalz | 2015-06-02 |
| 9041226 | Chip arrangement and a method of manufacturing a chip arrangement | Rainer Steiner, Edward Fuergut, Khalil Hosseini, Georg Meyer-Berg | 2015-05-26 |
| 9021887 | Micromechanical semiconductor sensing device | Franz-Peter Kalz, Horst Theuss, Bernhard Winkler, Khalil Hosseini, Manfred Mengel | 2015-05-05 |
| 9018742 | Electronic device and a method for fabricating an electronic device | Ivan Nikitin | 2015-04-28 |
| 9006873 | Method of manufacturing a semiconductor device with a carrier having a cavity and semiconductor device | Ivan Nikitin | 2015-04-14 |
| 8980687 | Semiconductor device and method of manufacturing thereof | Ivan Nikitin, Stefan Landau, Alexander Heinrich, Ralf Wombacher | 2015-03-17 |
| 8975711 | Device including two power semiconductor chips and manufacturing thereof | Ralf Otremba, Josef Hoeglauer, Johannes Lodermeyer | 2015-03-10 |
| 8947886 | Electronic component | Manfred Mengel, Khalil Hosseini, Klaus Schmidt, Franz-Peter Kalz | 2015-02-03 |
| 8916968 | Multichip power semiconductor device | Thomas Bemmerl, Anton Prueckl | 2014-12-23 |
| 8912450 | Method for attaching a metal surface to a carrier, a method for attaching a chip to a chip carrier, a chip-packaging module and a packaging module | Manfred Mengel, Khalil Hosseini, Franz-Peter Kalz | 2014-12-16 |
| 8896128 | Integrated circuit, a semiconductor die arrangement and a method for manufacturing an integrated circuit | Khalil Hosseini, Georg Meyer-Berg | 2014-11-25 |
| 8884420 | Multichip device | Khalil Hosseini, Ivan Nikitin | 2014-11-11 |
| 8884434 | Method and system for improving reliability of a semiconductor device | Manfred Mengel, Khalil Hosseini | 2014-11-11 |
| 8872315 | Electronic device and method of fabricating an electronic device | Khalil Hosseini, Ivan Nikitin, Gottfried Beer | 2014-10-28 |
| 8866274 | Semiconductor packages and methods of formation thereof | Hermann Gruber, Uwe Hoeckele, Anton Prueckl, Thomas Fischer, Matthias Schmidt | 2014-10-21 |
| 8866302 | Device including two semiconductor chips and manufacturing thereof | Henrik Ewe, Anton Prueckl, Stefan Landau | 2014-10-21 |
| 8847385 | Chip arrangement, a method for forming a chip arrangement, a chip package, a method for forming a chip package | Ralf Wombacher, Anton Prueckl | 2014-09-30 |
| 8835219 | Device contact, electric device package and method of manufacturing an electric device package | Khalil Hosseini | 2014-09-16 |