Issued Patents All Time
Showing 1–24 of 24 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9991183 | Semiconductor component having inner and outer semiconductor component housings | Josef Hoeglauer, Teck Sim Lee, Ralf Otremba, Klaus Schiess, Xaver Schloegel | 2018-06-05 |
| 9824958 | Chip carrier structure, chip package and method of manufacturing the same | Ralf Otremba, Josef Hoeglauer, Xaver Schloegel, Klaus Schiess | 2017-11-21 |
| 9786584 | Lateral element isolation device | Ralf Otremba, Josef Hoeglauer, Xaver Schloegel, Klaus Schiess | 2017-10-10 |
| 9627292 | Semiconductor housing with rear-side structuring | Ralf Otremba, Josef Hoeglauer, Xaver Schloegel | 2017-04-18 |
| 9449902 | Semiconductor packages having multiple lead frames and methods of formation thereof | Ralf Otremba, Josef Hoeglauer, Xaver Schloegel, Klaus Schiess | 2016-09-20 |
| 9412626 | Method for manufacturing a chip arrangement | Ralf Otremba, Josef Hoeglauer, Xaver Schloegel, Klaus Schiess, Bernd Roemer +1 more | 2016-08-09 |
| 9397018 | Chip arrangement, a method for manufacturing a chip arrangement, integrated circuits and a method for manufacturing an integrated circuit | Ralf Otremba, Josef Hoeglauer, Xaver Schloegel, Wolfram Hable, Manfred Mengel +2 more | 2016-07-19 |
| 9362240 | Electronic device | Khalil Hosseini, Joachim Mahler, Ralf Otremba, Josef Hoeglauer, Xaver Schloegel +1 more | 2016-06-07 |
| 9263440 | Power transistor arrangement and package having the same | Ralf Otremba, Josef Hoeglauer, Xaver Schloegel, Klaus Schiess | 2016-02-16 |
| 9230880 | Electronic device and method for fabricating an electronic device | Ralf Otremba, Josef Hoeglauer, Teck Sim Lee, Xaver Schloegel, Klaus Schiess | 2016-01-05 |
| 9184066 | Chip arrangements and methods for manufacturing a chip arrangement | Ralf Otremba, Josef Hoeglauer, Xaver Schloegel, Klaus Schiess, Bernd Roemer +1 more | 2015-11-10 |
| 9147628 | Package-in-packages and methods of formation thereof | Ralf Otremba, Josef Hoeglauer, Xaver Schloegel, Klaus Schiess | 2015-09-29 |
| 9147631 | Semiconductor power device having a heat sink | Ralf Otremba, Josef Hoeglauer, Xaver Schloegel, Klaus Schiess | 2015-09-29 |
| 9117786 | Chip module, an insulation material and a method for fabricating a chip module | Ralf Otremba, Josef Hoeglauer, Xaver Schloegel, Klaus Schiess | 2015-08-25 |
| 9099441 | Power transistor arrangement and method for manufacturing the same | Ralf Otremba, Josef Hoeglauer, Xaver Schloegel, Klaus Schiess | 2015-08-04 |
| 8975117 | Semiconductor device using diffusion soldering | Ralf Otremba, Fong Lim, Abdul Rahman Mohamed, Chooi Mei Chong, Ida Fischbach +2 more | 2015-03-10 |
| 8896106 | Semiconductor packages having multiple lead frames and methods of formation thereof | Ralf Otremba, Josef Hoeglauer, Xaver Schloegel, Klaus Schiess | 2014-11-25 |
| 8853849 | Package arrangement and a method of manufacturing a package arrangement | Ralf Otremba, Josef Hoeglauer, Xaver Schloegel, Klaus Schiess | 2014-10-07 |
| 8698293 | Multi-chip package and method of manufacturing thereof | Ralf Otremba, Josef Hoeglauer | 2014-04-15 |
| 8643176 | Power semiconductor chip having two metal layers on one face | Ralf Otremba, Josef Hoeglauer, Xaver Schloegel | 2014-02-04 |
| 7923827 | Semiconductor module for a switched-mode power supply and method for its assembly | Yang Hong Heng, Kean Cheong Lee, Xaver Schloegel, Gerhard Deml, Ralf Otremba | 2011-04-12 |
| 7821141 | Semiconductor device | Wae Chet Yong, Teck Sim Lee, Erich Griebl, Mario Feldvoss | 2010-10-26 |
| D609191 | Package for electronic device | Mario Feldvoss, Erich Griebl, Teck Sim Lee | 2010-02-02 |
| 7629676 | Semiconductor component having a semiconductor die and a leadframe | Ralf Otremba, Xaver Schloegel | 2009-12-08 |