Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11444045 | Bonding structures of semiconductor devices | Ramasamy Chockalingam, Juan Boon Tan, Xiaodong Li, Ranjan Rajoo | 2022-09-13 |
| 9768089 | Wafer stack protection seal | Ranjan Rajoo | 2017-09-19 |
| 9761561 | Edge structure for backgrinding asymmetrical bonded wafer | Ranjan Rajoo | 2017-09-12 |
| 9406577 | Wafer stack protection seal | Ranjan Rajoo | 2016-08-02 |
| 8610266 | Semiconductor device for radio frequency applications and method for making the same | Gerald Ofner | 2013-12-17 |
| 8603909 | Integrated circuit packaging system with core region and bond pad and method of manufacture thereof | Alfred Yeo | 2013-12-10 |
| 8048761 | Fabricating method for crack stop structure enhancement of integrated circuit seal ring | Alfred Yeo | 2011-11-01 |
| 8003448 | Semiconductor package and method for producing the same | Charles Wee Ming Lee, Gerald Ofner | 2011-08-23 |
| 7892963 | Integrated circuit packaging system and method of manufacture thereof | Alfred Yeo | 2011-02-22 |
| 7816235 | Semiconductor package and method for producing the same | Charles Wee Ming Lee, Gerald Ofner | 2010-10-19 |
| 7619304 | Panel and semiconductor component having a composite board with semiconductor chips and plastic package molding compound and method for the production thereof | Michael Bauer | 2009-11-17 |
| 7535111 | Semiconductor component with semiconductor chip and adhesive film, and method for its production | Michael Bauer | 2009-05-19 |
| 7452747 | Semiconductor package with contact support layer and method to produce the package | Charles Wee Ming Lee, Gerald Ofner | 2008-11-18 |