Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12341111 | Crackstop structures | Frank Kuechenmeister, Dirk Breuer | 2025-06-24 |
| 11658128 | Shielding elements for packages of semiconductor devices | Venkata Narayana Rao Vanukuru | 2023-05-23 |
| 11652069 | Crackstop structures | Frank Kuechenmeister, Dirk Breuer | 2023-05-16 |
| 11444045 | Bonding structures of semiconductor devices | Ramasamy Chockalingam, Juan Boon Tan, Xiaodong Li, Kai Chong Chan | 2022-09-13 |
| 11244915 | Bond pads of semiconductor devices | Ramasamy Chockalingam, Juan Boon Tan, Chee Kong Leong, Xuesong Rao, Xiaodong Li | 2022-02-08 |
| 9768089 | Wafer stack protection seal | Kai Chong Chan | 2017-09-19 |
| 9761561 | Edge structure for backgrinding asymmetrical bonded wafer | Kai Chong Chan | 2017-09-12 |
| 9406577 | Wafer stack protection seal | Kai Chong Chan | 2016-08-02 |
| 7500378 | Micro-impact testing apparatus | Kuo Tsing Tsai, Ee Hua Wong | 2009-03-10 |
| 7464606 | Bend testing apparatus and method of carrying out the same | Ee Hua Wong, Kah Woon Seah | 2008-12-16 |
| 7178711 | Method and device to elongate a solder joint | Ee Hua Wong, Wai Kwan Wong, Mahadevan Iyer | 2007-02-20 |
| 6890795 | Wafer level super stretch solder | Ee Hua Wong, Poi Siong Teo | 2005-05-10 |