Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11244915 | Bond pads of semiconductor devices | Ramasamy Chockalingam, Juan Boon Tan, Ranjan Rajoo, Xuesong Rao, Xiaodong Li | 2022-02-08 |
| 8188550 | Integrated circuit structure with electrical strap and its method of forming | Lieyong Yang, Siau Ben Chiah, Ming Lei, Hua Xiao, Xiongfei Yu +7 more | 2012-05-29 |
| 6517235 | Using refractory metal silicidation phase transition temperature points to control and/or calibrate RTP low temperature operation | Zhong Yun Zhu, Rajneesh Jaiswal, Haznita Abd Karim, Bei Chao Zhang, Johnny Cham +1 more | 2003-02-11 |