Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12087659 | Electronic power package and heat sink/cold rail arrangement | Binghua Pan, David W. Ihms | 2024-09-10 |
| 12063739 | Printed circuit board and fabrication thereof | Kok Wee Yeo, Andreas Aye | 2024-08-13 |
| 7453154 | Carbon nanotube via interconnect | Kiat Choon Teo, Binghua Pan | 2008-11-18 |
| 7189594 | Wafer level packages and methods of fabrication | Vaidyanathan Kripesh, Mihai Rotaru, Tai Chong Chai, Mahadevan Iyer | 2007-03-13 |
| 7178711 | Method and device to elongate a solder joint | Ee Hua Wong, Ranjan Rajoo, Mahadevan Iyer | 2007-02-20 |