DI

David W. Ihms

Delphi Technologies: 9 patents #304 of 4,124Top 8%
BT Borgwarner Us Technologies: 4 patents #6 of 37Top 20%
DL Delphi Technologies Ip Limited: 2 patents #57 of 322Top 20%
DE Delco Electronics: 1 patents #370 of 908Top 45%
Overall (All Time): #284,497 of 4,157,543Top 7%
16
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
12401295 Systems and methods for power module for inverter for electric vehicle David Paul Buehler, Kevin M. Gertiser, Mark W. Gose 2025-08-26
12368391 Systems and methods for power module for inverter for electric vehicle David Paul Buehler, Kevin M. Gertiser, Mark W. Gose 2025-07-22
12348157 Systems and methods for power module for inverter for electric vehicle David Paul Buehler, Kevin M. Gertiser, Mark W. Gose 2025-07-01
12284769 Conformal coating blockage by surface-mount technology solder features 2025-04-22
12087659 Electronic power package and heat sink/cold rail arrangement Binghua Pan, Wai Kwan Wong 2024-09-10
10163572 Ceramic-wound-capacitor with lead lanthanum zirconium titanate dielectric Manuel Ray Fairchild, Ralph S. Taylor, Celine Wk Wong 2018-12-25
9978707 Electrical-device adhesive barrier David W. Zimmerman, Michael J. Pepples 2018-05-22
9267415 Heat exchanger equipped with thermal electric device for engine exhaust carbon dioxide collection system Bruce A. Myers 2016-02-23
8696804 Carbon dioxide absorbent fluid for a carbon dioxide sequestering system on a vehicle Bruce A. Myers 2014-04-15
8480798 Vehicle system to separate and store carbon dioxide from engine exhaust Bruce A. Myers 2013-07-09
7918381 Process for attaching components with near-zero standoff to printed circuit boards Michael R. Witty, Joel D. Hunt 2011-04-05
7118940 Method of fabricating an electronic package having underfill standoff Bruce A. Myers, Todd P. Oman 2006-10-10
7119449 Enhancement of underfill physical properties by the addition of thermotropic cellulose Derek B. Workman, Arun K. Chaudhuri 2006-10-10
7094975 Circuit board with localized stiffener for enhanced circuit component reliability Suresh K. Chengalva, Bruce A. Myers 2006-08-22
7038321 Method of attaching a flip chip device and circuit assembly formed thereby Abhijeet V. Chavan, Jeffrey A. Mars, Ian D. Jay, Johnna L. Wyant, John K. Isenberg +1 more 2006-05-02
5089748 Photo-feedback drive system 1992-02-18