Issued Patents All Time
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12401295 | Systems and methods for power module for inverter for electric vehicle | David Paul Buehler, Kevin M. Gertiser, Mark W. Gose | 2025-08-26 |
| 12368391 | Systems and methods for power module for inverter for electric vehicle | David Paul Buehler, Kevin M. Gertiser, Mark W. Gose | 2025-07-22 |
| 12348157 | Systems and methods for power module for inverter for electric vehicle | David Paul Buehler, Kevin M. Gertiser, Mark W. Gose | 2025-07-01 |
| 12284769 | Conformal coating blockage by surface-mount technology solder features | — | 2025-04-22 |
| 12087659 | Electronic power package and heat sink/cold rail arrangement | Binghua Pan, Wai Kwan Wong | 2024-09-10 |
| 10163572 | Ceramic-wound-capacitor with lead lanthanum zirconium titanate dielectric | Manuel Ray Fairchild, Ralph S. Taylor, Celine Wk Wong | 2018-12-25 |
| 9978707 | Electrical-device adhesive barrier | David W. Zimmerman, Michael J. Pepples | 2018-05-22 |
| 9267415 | Heat exchanger equipped with thermal electric device for engine exhaust carbon dioxide collection system | Bruce A. Myers | 2016-02-23 |
| 8696804 | Carbon dioxide absorbent fluid for a carbon dioxide sequestering system on a vehicle | Bruce A. Myers | 2014-04-15 |
| 8480798 | Vehicle system to separate and store carbon dioxide from engine exhaust | Bruce A. Myers | 2013-07-09 |
| 7918381 | Process for attaching components with near-zero standoff to printed circuit boards | Michael R. Witty, Joel D. Hunt | 2011-04-05 |
| 7118940 | Method of fabricating an electronic package having underfill standoff | Bruce A. Myers, Todd P. Oman | 2006-10-10 |
| 7119449 | Enhancement of underfill physical properties by the addition of thermotropic cellulose | Derek B. Workman, Arun K. Chaudhuri | 2006-10-10 |
| 7094975 | Circuit board with localized stiffener for enhanced circuit component reliability | Suresh K. Chengalva, Bruce A. Myers | 2006-08-22 |
| 7038321 | Method of attaching a flip chip device and circuit assembly formed thereby | Abhijeet V. Chavan, Jeffrey A. Mars, Ian D. Jay, Johnna L. Wyant, John K. Isenberg +1 more | 2006-05-02 |
| 5089748 | Photo-feedback drive system | — | 1992-02-18 |