Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7790814 | Radiopaque polymers for circuit board assembly | Rafil A. Basheer | 2010-09-07 |
| 7754824 | Dendritic polyol, cycloaliphatic epoxy resin and cationic initiator | Rafil A. Basheer, Arun K. Chaudhuri, Mohamed Bouguettaya | 2010-07-13 |
| 7498197 | Silica nanoparticles thermoset resin compositions | Rafil A. Basheer, Mohamed Bouguettaya | 2009-03-03 |
| 7331106 | Underfill method | Arun K. Chaundhuri, Eric Berg | 2008-02-19 |
| 7205652 | Electronic assembly including multiple substrates | M. Ray Fairchild, Dwadasi Hare Rama Sarma, Daniel R. Harshbarger | 2007-04-17 |
| 7202571 | Electronic module with form in-place pedestal | Brian Thompson, Charles I. Delheimer, Jeenhuei Tsai, Matthew R. Walsh, Scott D. Brandenburg | 2007-04-10 |
| 7119449 | Enhancement of underfill physical properties by the addition of thermotropic cellulose | Arun K. Chaudhuri, David W. Ihms | 2006-10-10 |
| 6943058 | No-flow underfill process and material therefor | Arun K. Chaudhuri, Frank Stepniak, Matthew R. Walsh | 2005-09-13 |
| 6660560 | No-flow underfill material and underfill method for flip chip devices | Arun K. Chaudhuri, Matthew R. Walsh | 2003-12-09 |