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Resource-centric network cyber attack warning system |
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Resource-centric network cyber attack warning system |
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Resource-centric network cyber attack warning system |
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2020-07-21 |
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Event detection system having multiple sensor systems in cooperation with an impact detection system |
Alexander M. Soles, Eric B. Scott |
2017-09-26 |
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Vehicle damage detection system and method of manufacturing the same |
Alexander M. Soles, Eric B. Scott |
2016-08-30 |
| 9235378 |
Vehicle damage detection system and method of manufacturing the same |
Alexander M. Soles, Eric B. Scott |
2016-01-12 |
| 9081409 |
Event detection control system for operating a remote sensor or projectile system |
Alexander M. Soles, Eric B. Scott |
2015-07-14 |
| 8977507 |
Event detection system user interface system coupled to multiple sensors including an impact detection system |
Alexander M. Soles, Eric B. Scott |
2015-03-10 |
| 8788218 |
Event detection system having multiple sensor systems in cooperation with an impact detection system |
Alexander M. Soles, Eric B. Scott |
2014-07-22 |
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Vehicle damage detection system |
Alexander M. Soles, Eric B. Scott |
2014-07-22 |
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Microwave communication package |
Deepukumar M. Nair, David W. Zimmerman, Benjamen E. Haffke, Scott D. Brandenburg, Charles I. Delheimer +2 more |
2010-12-21 |
| 7422448 |
Surface mount connector |
Scott D. Brandenburg, Thomas A. Degenkolb |
2008-09-09 |
| 7268429 |
Technique for manufacturing an overmolded electronic assembly |
Scott D. Brandenburg, David A. Laudick, Thomas A. Degenkolb, Jeenhuei Tsai |
2007-09-11 |
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Electronic module with form in-place pedestal |
Brian Thompson, Charles I. Delheimer, Derek B. Workman, Jeenhuei Tsai, Scott D. Brandenburg |
2007-04-10 |
| 6999317 |
Thermally enhanced electronic module with self-aligning heat sink |
Suresh K. Chengalva, Gary E. Oberlin |
2006-02-14 |
| 6943058 |
No-flow underfill process and material therefor |
Arun K. Chaudhuri, Derek B. Workman, Frank Stepniak |
2005-09-13 |
| 6916684 |
Wafer-applied underfill process |
Frank Stepniak, Arun K. Chaudhuri, Michael Varnau |
2005-07-12 |
| 6833628 |
Mutli-chip module |
Scott D. Brandenburg, Darrel E. Peugh |
2004-12-21 |
| 6802446 |
Conductive adhesive material with metallurgically-bonded conductive particles |
Arun K. Chaudhuri, Frank Stepniak |
2004-10-12 |
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No-flow underfill material and underfill method for flip chip devices |
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2003-12-09 |
