| 9621874 |
Multiple imager camera |
Daniel Leong Woon Loong, Kok Wee Yeo, Yew Kwang Low, Ronald M. Taylor, Ward K. Everly +1 more |
2017-04-11 |
| 9506803 |
Vehicle optical sensor system |
Yew Kwang Low, Kok Wee Yeo, Ronald M. Taylor, Ward K. Everly, Morgan D. Murphy |
2016-11-29 |
| 8471380 |
Fluid cooled encapsulated microelectronic package |
Scott D. Brandenburg, Suresh K. Chengalva |
2013-06-25 |
| 8026597 |
Fluid cooled encapsulated microelectronic package |
Scott D. Brandenburg, Suresh K. Chengalva |
2011-09-27 |
| 7759778 |
Leaded semiconductor power module with direct bonding and double sided cooling |
Michael Lowry, Eric A. Brauer, Victor C. Wong |
2010-07-20 |
| 7621757 |
Solderless electrical interconnection for electronic package |
Scott D. Brandenburg |
2009-11-24 |
| 7616448 |
Wrap-around overmold for electronic assembly |
Scott D. Brandenburg, Larry M. Mandel, Kin Yean Chow, Ching Meng Fang, Sim Ying Yong |
2009-11-10 |
| 7537464 |
Electrical pin interconnection for electronic package |
Scott D. Brandenburg |
2009-05-26 |
| 7485957 |
Fluid cooled encapsulated microelectronic package |
Scott D. Brandenburg, Suresh K. Chengalva |
2009-02-03 |
| 7447041 |
Compression connection for vertical IC packages |
Scott D. Brandenburg, Shing Yeh |
2008-11-04 |
| 7422448 |
Surface mount connector |
Scott D. Brandenburg, Matthew R. Walsh |
2008-09-09 |
| 7364684 |
Method of making an encapsulated microelectronic package having fluid carrying encapsulant channels |
Scott D. Brandenburg, Suresh K. Chengalva |
2008-04-29 |
| 7324342 |
Electronics assembly and electronics package carrier therefor |
Ralph S. Taylor, Loren Rasmussen |
2008-01-29 |
| 7268429 |
Technique for manufacturing an overmolded electronic assembly |
Scott D. Brandenburg, David A. Laudick, Matthew R. Walsh, Jeenhuei Tsai |
2007-09-11 |
| 7227758 |
Printed circuit board assembly with integrated connector |
Scott D. Brandenburg |
2007-06-05 |
| 7205653 |
Fluid cooled encapsulated microelectronic package |
Scott D. Brandenburg, Suresh K. Chengalva |
2007-04-17 |
| 7106588 |
Power electronic system with passive cooling |
Gary E. Oberlin, Bruce A. Myers, Darrel E. Peugh |
2006-09-12 |
| 7064963 |
Multi-substrate circuit assembly |
Todd P. Oman |
2006-06-20 |
| 6905349 |
Technique for connector to printed circuit board decoupling to eliminate flexure |
Scott D. Brandenburg, David A. Laudick, Larry M. Mandel, Richard D. Parker |
2005-06-14 |
| 6779260 |
Overmolded electronic package including circuit-carrying substrate |
Scott D. Brandenburg, Bruce A. Myers |
2004-08-24 |
| 6560110 |
Corrosive resistant flip chip thermal management structure |
Bruce A. Myers, Henry M. Sanftleben, Darrel E. Peugh |
2003-05-06 |
| 6535396 |
Combination circuit board and segmented conductive bus substrate |
Darrel E. Peugh, Bruce A. Myers |
2003-03-18 |
