Shing Yeh — 15 Patents at Delphi Technologies

Shing Yeh has been granted 15 US patents while listed as an inventor at Delphi Technologies. The first was granted in 1996 and the most recent in March 2020. Shing Yeh ranks #307,048 of 4,157,543 US inventors in our database (top 7.4%). Patent records list Shing Yeh in Buffalo Grove, IL, US.

Issued Patents All Time

Showing 1–15 of 15 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
10600206	Tracking system and method thereof	Yuan Chen, Po-I Wu, Heng Ding, Kun-Chun Tsai	2020-03-24
7726972	Liquid metal rotary connector apparatus for a vehicle steering wheel and column	Scott D. Brandenburg, Mark W. Gose	2010-06-01
7447041	Compression connection for vertical IC packages	Scott D. Brandenburg, Thomas A. Degenkolb	2008-11-04
6811892	Lead-based solder alloys containing copper	Bradley H. Carter, Frank Stepniak, Scott D. Brandenburg	2004-11-02	$2,697,000
6767411	Lead-free solder alloy and solder reflow process	Bradley H. Carter, Curtis W. Melcher	2004-07-27	$6,595,000
6630251	Leach-resistant solder alloys for silver-based thick-film conductors	Bradley H. Carter	2003-10-07	$5,453,000
6619536	Solder process and solder alloy therefor	Scott D. Brandenburg, Bradley H. Carter	2003-09-16	$3,885,000
6570260	Solder process and solder alloy therefor	Scott D. Brandenburg, Bradley H. Carter	2003-05-27	$8,591,000
6281106	Method of solder bumping a circuit component	William D. Higdon, Frank Stepniak	2001-08-28	$11,363,000
6251501	Surface mount circuit device and solder bumping method therefor	William D. Higdon	2001-06-26	$31,736,000
6062461	Process for bonding micromachined wafers using solder	Douglas Ray Sparks, Larry L. Jordan, Ruth Ellen Beni, Anthony Alan Duffer	2000-05-16	$58,683,000
5938862	Fatigue-resistant lead-free alloy	Curtis W. Melcher, Bradley H. Carter	1999-08-17
5803340	Composite solder paste for flip chip bumping	Bradley H. Carter	1998-09-08
5607099	Solder bump transfer device for flip chip integrated circuit devices	William D. Higdon, Ralph Edward Cornell	1997-03-04
5491364	Reduced stress terminal pattern for integrated circuit devices and packages	Scott D. Brandenburg, William S. Murphy, Ahmer Syed, David King	1996-02-13

Shing Yeh — 15 Patents

Issued Patents All Time

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