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| 7447041 |
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| 6811892 |
Lead-based solder alloys containing copper |
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2004-11-02 |
| 6767411 |
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2004-07-27 |
| 6630251 |
Leach-resistant solder alloys for silver-based thick-film conductors |
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2003-10-07 |
| 6619536 |
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2003-09-16 |
| 6570260 |
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2003-05-27 |
| 6281106 |
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2001-08-28 |
| 6251501 |
Surface mount circuit device and solder bumping method therefor |
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2001-06-26 |
| 6062461 |
Process for bonding micromachined wafers using solder |
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2000-05-16 |
| 5938862 |
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1999-08-17 |
| 5803340 |
Composite solder paste for flip chip bumping |
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1998-09-08 |
| 5607099 |
Solder bump transfer device for flip chip integrated circuit devices |
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| 5491364 |
Reduced stress terminal pattern for integrated circuit devices and packages |
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1996-02-13 |
