Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10600206 | Tracking system and method thereof | Yuan Chen, Po-I Wu, Heng Ding, Kun-Chun Tsai | 2020-03-24 |
| 7726972 | Liquid metal rotary connector apparatus for a vehicle steering wheel and column | Scott D. Brandenburg, Mark W. Gose | 2010-06-01 |
| 7447041 | Compression connection for vertical IC packages | Scott D. Brandenburg, Thomas A. Degenkolb | 2008-11-04 |
| 6811892 | Lead-based solder alloys containing copper | Bradley H. Carter, Frank Stepniak, Scott D. Brandenburg | 2004-11-02 |
| 6767411 | Lead-free solder alloy and solder reflow process | Bradley H. Carter, Curtis W. Melcher | 2004-07-27 |
| 6630251 | Leach-resistant solder alloys for silver-based thick-film conductors | Bradley H. Carter | 2003-10-07 |
| 6619536 | Solder process and solder alloy therefor | Scott D. Brandenburg, Bradley H. Carter | 2003-09-16 |
| 6570260 | Solder process and solder alloy therefor | Scott D. Brandenburg, Bradley H. Carter | 2003-05-27 |
| 6281106 | Method of solder bumping a circuit component | William D. Higdon, Frank Stepniak | 2001-08-28 |
| 6251501 | Surface mount circuit device and solder bumping method therefor | William D. Higdon | 2001-06-26 |
| 6062461 | Process for bonding micromachined wafers using solder | Douglas Ray Sparks, Larry L. Jordan, Ruth Ellen Beni, Anthony Alan Duffer | 2000-05-16 |
| 5938862 | Fatigue-resistant lead-free alloy | Curtis W. Melcher, Bradley H. Carter | 1999-08-17 |
| 5803340 | Composite solder paste for flip chip bumping | Bradley H. Carter | 1998-09-08 |
| 5607099 | Solder bump transfer device for flip chip integrated circuit devices | William D. Higdon, Ralph Edward Cornell | 1997-03-04 |
| 5491364 | Reduced stress terminal pattern for integrated circuit devices and packages | Scott D. Brandenburg, William S. Murphy, Ahmer Syed, David King | 1996-02-13 |