Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6184581 | Solder bump input/output pad for a surface mount circuit device | Aparna Vaidyanthan, Curt A Erickson | 2001-02-06 |
| 5926731 | Method for controlling solder bump shape and stand-off height | Christine Redder Coapman, Christine Ann Paszkiet | 1999-07-20 |
| 5607099 | Solder bump transfer device for flip chip integrated circuit devices | Shing Yeh, William D. Higdon | 1997-03-04 |
| 5547740 | Solderable contacts for flip chip integrated circuit devices | William D. Higdon, Susan Acheson Mack | 1996-08-20 |