Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6391678 | Method for controlling solderability of a conductor and conductor formed thereby | Christine Redder Coapman, Anthony John Stankavich | 2002-05-21 |
| 5962151 | Method for controlling solderability of a conductor and conductor formed thereby | Carl W. Berlin, Stephanie Yolanda Oden | 1999-10-05 |
| 5928568 | Thick film circuit having conductor composition with coated metallic particles | Dwadasi Hare Rama Sarma | 1999-07-27 |
| 5926731 | Method for controlling solder bump shape and stand-off height | Christine Redder Coapman, Ralph Edward Cornell | 1999-07-20 |
| 5803344 | Dual-solder process for enhancing reliability of thick-film hybrid circuits | Anthony John Stankavich, Dwadasi Hare Rama Sarma, Marion Edmond Ellis | 1998-09-08 |
| 5803343 | Solder process for enhancing reliability of multilayer hybrid circuits | Dwadasi Hare Rama Sarma, James Catlin Orem, Christopher Needes | 1998-09-08 |
| 5716552 | Thick-film conductor compostions comprising silver or palladium particles coated with alumina or zirconia | Dwadasi Hare Rama Sarma | 1998-02-10 |
| 5527999 | Multilayer conductor for printed circuits | Bradley R. Knigga | 1996-06-18 |