Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6184581 | Solder bump input/output pad for a surface mount circuit device | Ralph Edward Cornell, Aparna Vaidyanthan | 2001-02-06 |
| 6180265 | Flip chip solder bump pad | — | 2001-01-30 |
| 5891756 | Process for converting a wire bond pad to a flip chip solder bump pad and pad formed thereby | — | 1999-04-06 |