| 6822327 |
Flip-chip interconnected with increased current-carrying capability |
Pankaj Mithal, Mark W. Gose, John Mark Dikeman, Frank Stepniak |
2004-11-23 |
| 6375062 |
Surface bumping method and structure formed thereby |
Frank Stepniak |
2002-04-23 |
| 6281106 |
Method of solder bumping a circuit component |
Frank Stepniak, Shing Yeh |
2001-08-28 |
| 6251501 |
Surface mount circuit device and solder bumping method therefor |
Shing Yeh |
2001-06-26 |
| 5607099 |
Solder bump transfer device for flip chip integrated circuit devices |
Shing Yeh, Ralph Edward Cornell |
1997-03-04 |
| 5547740 |
Solderable contacts for flip chip integrated circuit devices |
Susan Acheson Mack, Ralph Edward Cornell |
1996-08-20 |
| 5115245 |
Single substrate microwave radar transceiver including flip-chip integrated circuits |
Cheng P. Wen, Gregory Mendolia, Mario Siracusa, Joseph J. Maieron, John J. Wooldridge +1 more |
1992-05-19 |
| 5087896 |
Flip-chip MMIC oscillator assembly with off-chip coplanar waveguide resonant inductor |
Cheng P. Wen, Gregory Mendolia, Mario Siracusa, Joseph J. Maieron |
1992-02-11 |
| 4400681 |
Semiconductor pressure sensor with slanted resistors |
Ronald E. Brown, Lamonte R. Edison |
1983-08-23 |
