Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6822327 | Flip-chip interconnected with increased current-carrying capability | Pankaj Mithal, Mark W. Gose, John Mark Dikeman, Frank Stepniak | 2004-11-23 |
| 6375062 | Surface bumping method and structure formed thereby | Frank Stepniak | 2002-04-23 |
| 6281106 | Method of solder bumping a circuit component | Frank Stepniak, Shing Yeh | 2001-08-28 |
| 6251501 | Surface mount circuit device and solder bumping method therefor | Shing Yeh | 2001-06-26 |
| 5607099 | Solder bump transfer device for flip chip integrated circuit devices | Shing Yeh, Ralph Edward Cornell | 1997-03-04 |
| 5547740 | Solderable contacts for flip chip integrated circuit devices | Susan Acheson Mack, Ralph Edward Cornell | 1996-08-20 |
| 5115245 | Single substrate microwave radar transceiver including flip-chip integrated circuits | Cheng P. Wen, Gregory Mendolia, Mario Siracusa, Joseph J. Maieron, John J. Wooldridge +1 more | 1992-05-19 |
| 5087896 | Flip-chip MMIC oscillator assembly with off-chip coplanar waveguide resonant inductor | Cheng P. Wen, Gregory Mendolia, Mario Siracusa, Joseph J. Maieron | 1992-02-11 |
| 4400681 | Semiconductor pressure sensor with slanted resistors | Ronald E. Brown, Lamonte R. Edison | 1983-08-23 |