Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6062461 | Process for bonding micromachined wafers using solder | Douglas Ray Sparks, Larry L. Jordan, Ruth Ellen Beni, Shing Yeh | 2000-05-16 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6062461 | Process for bonding micromachined wafers using solder | Douglas Ray Sparks, Larry L. Jordan, Ruth Ellen Beni, Shing Yeh | 2000-05-16 |