Issued Patents All Time
Showing 25 most recent of 42 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9267415 | Heat exchanger equipped with thermal electric device for engine exhaust carbon dioxide collection system | David W. Ihms | 2016-02-23 |
| 8696804 | Carbon dioxide absorbent fluid for a carbon dioxide sequestering system on a vehicle | David W. Ihms | 2014-04-15 |
| 8480798 | Vehicle system to separate and store carbon dioxide from engine exhaust | David W. Ihms | 2013-07-09 |
| 8438862 | Thermally-protected chamber for a temperature-sensitive consumer electronic device | Todd P. Oman, Craig A. Tieman, Michel F. Sultan, Dale L. Partin | 2013-05-14 |
| 7795726 | Liquid cooled power electronic circuit comprising a stacked array of directly cooled semiconductor chips | Eric A. Brauer | 2010-09-14 |
| 7782616 | Heat-dissipating component having stair-stepped coolant channels | Suresh K. Chengalva, Darrell E. Peugh | 2010-08-24 |
| 7608924 | Liquid cooled power electronic circuit comprising stacked direct die cooled packages | Joseph M. Ratell | 2009-10-27 |
| 7574793 | Process of forming a laminate ceramic circuit board | Dwadasi Hare Rama Sarma, Rhonda Jean Heytens, Carl W. Berlin, Manuel Ray Fairchild, Daniel Ward | 2009-08-18 |
| 7561436 | Circuit assembly with surface-mount IC package and heat sink | Scott D. Brandenburg | 2009-07-14 |
| 7551439 | Fluid cooled electronic assembly | Darrel E. Peugh, Gary E. Oberlin | 2009-06-23 |
| 7538425 | Power semiconductor package having integral fluid cooling | Darrel E. Peugh, Lester Wilkinson, Erich W. Gerbsch | 2009-05-26 |
| 7498376 | Thermal transient suppression material and method of production | Arun K. Chaudhuri | 2009-03-03 |
| 7365981 | Fluid-cooled electronic system | Darrel E. Peugh, Henry M. Sanftleben | 2008-04-29 |
| 7352070 | Polymer encapsulated electrical devices | Thomas Ellis, Glen Novak, Scott D. Brandenburg, Jeenhuei Tsai | 2008-04-01 |
| 7334243 | Vane integration into motor hub to enhance CD cooling | Suresh K. Chengalva, Scott Wilson | 2008-02-19 |
| 7321098 | Laminate ceramic circuit board and process therefor | Dwadasi Hare Rama Sarma, Rhonda Jean Heytens, Carl W. Berlin, Manuel Ray Fairchild, Daniel Ward | 2008-01-22 |
| 7307841 | Electronic package and method of cooling electronics | Carl W. Berlin, Suresh K. Chengalva, Scott D. Brandenburg | 2007-12-11 |
| 7294926 | Chip cooling system | Peter J. Schubert | 2007-11-13 |
| 7269017 | Thermal management of surface-mount circuit devices on laminate ceramic substrate | Carl W. Berlin, Dwadasi H. R. Sarma | 2007-09-11 |
| 7215547 | Integrated cooling system for electronic devices | Shih-Chia Chang, Darrel E. Peugh, Carl W. Berlin, M. Ray Fairchild | 2007-05-08 |
| 7132746 | Electronic assembly with solder-bonded heat sink | Scott D. Brandenburg | 2006-11-07 |
| 7118940 | Method of fabricating an electronic package having underfill standoff | David W. Ihms, Todd P. Oman | 2006-10-10 |
| 7106588 | Power electronic system with passive cooling | Gary E. Oberlin, Thomas A. Degenkolb, Darrel E. Peugh | 2006-09-12 |
| 7094975 | Circuit board with localized stiffener for enhanced circuit component reliability | Suresh K. Chengalva, David W. Ihms | 2006-08-22 |
| 6979900 | Integrated circuit package with integral leadframe convector and method therefor | Suresh K. Chengalva | 2005-12-27 |