| 12419520 |
Wearable device |
Todd Andrew Newhouse, Evan Einbender Aamodt, Hooman Abediasl, Adrian Williamson Bahani, Kate LeeAnn Bechtel +25 more |
2025-09-23 |
| 9726514 |
Navigation system that displays other-vehicle information |
Devaiah Aiappa Pudiyathanda, Vijayalakshmi Kr, Pramod Narayanan Kaniampal, Scott D. Brandenburg |
2017-08-08 |
| 8797739 |
Self circulating heat exchanger |
Scott D. Brandenburg |
2014-08-05 |
| 8471380 |
Fluid cooled encapsulated microelectronic package |
Scott D. Brandenburg, Thomas A. Degenkolb |
2013-06-25 |
| 8026597 |
Fluid cooled encapsulated microelectronic package |
Scott D. Brandenburg, Thomas A. Degenkolb |
2011-09-27 |
| 7782616 |
Heat-dissipating component having stair-stepped coolant channels |
Bruce A. Myers, Darrell E. Peugh |
2010-08-24 |
| 7485957 |
Fluid cooled encapsulated microelectronic package |
Scott D. Brandenburg, Thomas A. Degenkolb |
2009-02-03 |
| 7486515 |
Fluid circulator for fluid cooled electronic device |
Scott D. Brandenburg |
2009-02-03 |
| 7440282 |
Heat sink electronic package having compliant pedestal |
Scott D. Brandenburg, David W. Zimmerman |
2008-10-21 |
| 7364684 |
Method of making an encapsulated microelectronic package having fluid carrying encapsulant channels |
Scott D. Brandenburg, Thomas A. Degenkolb |
2008-04-29 |
| 7365273 |
Thermal management of surface-mount circuit devices |
Manuel Ray Fairchild, David W. Zimmerman |
2008-04-29 |
| 7352585 |
Flip chip heat sink package and method |
Larry M. Mandel, Kevin M. Gertiser, Dwadasi Hare Rama Sarma, David W. Zimmerman |
2008-04-01 |
| 7334243 |
Vane integration into motor hub to enhance CD cooling |
Scott Wilson, Bruce A. Myers |
2008-02-19 |
| 7307841 |
Electronic package and method of cooling electronics |
Carl W. Berlin, Scott D. Brandenburg, Bruce A. Myers |
2007-12-11 |
| 7230832 |
Cooled electronic assembly and method for cooling a printed circuit board |
Scott D. Brandenburg |
2007-06-12 |
| 7205653 |
Fluid cooled encapsulated microelectronic package |
Scott D. Brandenburg, Thomas A. Degenkolb |
2007-04-17 |
| 7180745 |
Flip chip heat sink package and method |
Larry M. Mandel, Kevin M. Gertiser, Dwadasi Hare Rama Sarma, David W. Zimmerman |
2007-02-20 |
| 7094975 |
Circuit board with localized stiffener for enhanced circuit component reliability |
David W. Ihms, Bruce A. Myers |
2006-08-22 |
| 6999317 |
Thermally enhanced electronic module with self-aligning heat sink |
Gary E. Oberlin, Matthew R. Walsh |
2006-02-14 |
| 6979900 |
Integrated circuit package with integral leadframe convector and method therefor |
Bruce A. Myers |
2005-12-27 |
| 6807731 |
Method for forming an electronic assembly |
Scott D. Brandenburg, Bruce A. Myers, Jeenhuei Tsai |
2004-10-26 |
