Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7551439 | Fluid cooled electronic assembly | Bruce A. Myers, Gary E. Oberlin | 2009-06-23 |
| 7538425 | Power semiconductor package having integral fluid cooling | Bruce A. Myers, Lester Wilkinson, Erich W. Gerbsch | 2009-05-26 |
| 7365981 | Fluid-cooled electronic system | Bruce A. Myers, Henry M. Sanftleben | 2008-04-29 |
| 7215547 | Integrated cooling system for electronic devices | Shih-Chia Chang, Bruce A. Myers, Carl W. Berlin, M. Ray Fairchild | 2007-05-08 |
| 7106588 | Power electronic system with passive cooling | Gary E. Oberlin, Bruce A. Myers, Thomas A. Degenkolb | 2006-09-12 |
| 6833628 | Mutli-chip module | Scott D. Brandenburg, Matthew R. Walsh | 2004-12-21 |
| 6560110 | Corrosive resistant flip chip thermal management structure | Bruce A. Myers, Thomas A. Degenkolb, Henry M. Sanftleben | 2003-05-06 |
| 6535396 | Combination circuit board and segmented conductive bus substrate | Thomas A. Degenkolb, Bruce A. Myers | 2003-03-18 |
| 6156980 | Flip chip on circuit board with enhanced heat dissipation and method therefor | Joanna Berndt, Bruce A. Myers | 2000-12-05 |
| 6045032 | Method of preventing solder reflow of electrical components during wave soldering | Stuart E Longgood, Douglas E Gullion, Wayne Anthony Sozansky | 2000-04-04 |
| 5953814 | Process for producing flip chip circuit board assembly exhibiting enhanced reliability | Wayne Anthony Sozansky, Michael D. Gibson, Susan Acheson Mack, Michael Patrick Meehan, James M. Rosson +2 more | 1999-09-21 |