Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5953814 | Process for producing flip chip circuit board assembly exhibiting enhanced reliability | Wayne Anthony Sozansky, Michael D. Gibson, Susan Acheson Mack, Michael Patrick Meehan, Darrel E. Peugh +2 more | 1999-09-21 |
| 5759730 | Solder joint encapsulation material | Ralph D. Hermansen, Theresa Renee Lindley, Samuel R. Wennberg, Henry M. Sanftleben | 1998-06-02 |
| 5708056 | Hot melt epoxy encapsulation material | Theresa Renee Lindley, Samuel R. Wennberg, Henry M. Sanftleben, Ralph D. Hermansen | 1998-01-13 |
| 5510138 | Hot melt conformal coating materials | Henry M. Sanftleben, Ralph D. Hermansen | 1996-04-23 |
| 5460767 | Hot melt masking materials | Henry M. Sanftleben | 1995-10-24 |