SW

Samuel R. Wennberg

DE Delco Electronics: 2 patents #209 of 908Top 25%
HL Hughes Electronics Limited: 1 patents #605 of 1,474Top 45%
📍 Kokomo, IN: #238 of 628 inventorsTop 40%
🗺 Indiana: #13,671 of 33,936 inventorsTop 45%
Overall (All Time): #2,256,568 of 4,157,543Top 55%
2
Patents All Time

Issued Patents All Time

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
5759730 Solder joint encapsulation material Ralph D. Hermansen, Theresa Renee Lindley, Henry M. Sanftleben, James M. Rosson 1998-06-02
5708056 Hot melt epoxy encapsulation material Theresa Renee Lindley, Henry M. Sanftleben, James M. Rosson, Ralph D. Hermansen 1998-01-13