RH

Ralph D. Hermansen

HA Hughes Aircraft: 11 patents #70 of 2,963Top 3%
DE Delco Electronics: 5 patents #59 of 908Top 7%
RTX (Raytheon): 5 patents #2,369 of 15,912Top 15%
HL Hughes Electronics Limited: 2 patents #325 of 1,474Top 25%
📍 San Fernando, CA: #63 of 2,303 inventorsTop 3%
🗺 California: #28,827 of 386,348 inventorsTop 8%
Overall (All Time): #226,061 of 4,157,543Top 6%
20
Patents All Time

Issued Patents All Time

Showing 1–20 of 20 patents

Patent #TitleCo-InventorsDate
6723803 Adhesive of flexible epoxy resin and latent dihydrazide Steven E. Lau 2004-04-20
6132850 Reworkable, thermally-conductive adhesives for electronic assemblies Richard F. Davis, E. Dean Johnston 2000-10-17
6060539 Room-temperature stable, one-component, thermally-conductive, flexible epoxy adhesives Steven E. Lau 2000-05-09
5965673 Epoxy-terminated prepolymer of polyepoxide and diamine with curing agent Steven E. Lau 1999-10-12
5929141 Adhesive of epoxy resin, amine-terminated ban and conductive filler Steven E. Lau, Deborah S. Huff, E. Dean Johnston 1999-07-27
5840829 Plateable structural adhesive for cyanate ester composites Brian M. Punsly, Wai-Cheng Seetoo 1998-11-24
5780581 Plateable structural adhesive for cyanate ester composites Brian M. Punsly, Wai-Cheng Seetoo 1998-07-14
5759730 Solder joint encapsulation material Theresa Renee Lindley, Samuel R. Wennberg, Henry M. Sanftleben, James M. Rosson 1998-06-02
5708056 Hot melt epoxy encapsulation material Theresa Renee Lindley, Samuel R. Wennberg, Henry M. Sanftleben, James M. Rosson 1998-01-13
5608028 Polybutadiene urethane potting material Henry M. Sanftleben 1997-03-04
5575956 Room-temperature stable, one-component, electrically-conductive, flexible epoxy adhesives Steven E. Lau 1996-11-19
5510138 Hot melt conformal coating materials Henry M. Sanftleben, James M. Rosson 1996-04-23
5457165 Encapsulant of amine-cured epoxy resin blends Steven E. Lau 1995-10-10
5385966 Frozen premix, fillet-holding urethane adhesives/sealants Steven E. Lau 1995-01-31
5367006 Superior thermal transfer adhesive Steven E. Lau 1994-11-22
5350779 Low exotherm, low temperature curing, epoxy impregnants Steven E. Lau 1994-09-27
5185498 Circuit assembly encapsulated with polybutadiene urethane Henry M. Sanftleben, Gary R. Shelton, Petrina L. Schnabel, Dennis T. Baird, Douglas C. Smith 1993-02-09
4940633 Method of bonding metals with a radio-opaque adhesive/sealant for void detection and product made Thomas H. Sutherland, Roamer Predmore 1990-07-10
4866108 Flexible epoxy adhesive blend David J. Vachon, Steven E. Lau 1989-09-12
4534882 Method of making an epoxy prepolymer curing agent Norman Bilow 1985-08-13