Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5400950 | Method for controlling solder bump height for flip chip integrated circuit devices | Bruce A. Myers | 1995-03-28 |
| 5185498 | Circuit assembly encapsulated with polybutadiene urethane | Henry M. Sanftleben, Ralph D. Hermansen, Gary R. Shelton, Dennis T. Baird, Douglas C. Smith | 1993-02-09 |