Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8699225 | Liquid cooled electronics assembly suitable to use electrically conductive coolant | Scott D. Brandenburg, Richard D. Parker, Gary L. Eesley, Carl W. Berlin | 2014-04-15 |
| 7960817 | Semiconductor power module with flexible circuit leadframe | Robert Maple, Monty B. Hayes, Robert J. Campbell | 2011-06-14 |
| 7834448 | Fluid cooled semiconductor power module having double-sided cooling | — | 2010-11-16 |
| 7697303 | Dual-sided substrate integrated circuit package including a leadframe having leads with increased thickness | Roger A Mock | 2010-04-13 |
| 7538425 | Power semiconductor package having integral fluid cooling | Bruce A. Myers, Darrel E. Peugh, Lester Wilkinson | 2009-05-26 |
| 7423332 | Vertical laminated electrical switch circuit | Monty B. Hayes, Robert J. Campbell | 2008-09-09 |
| 7295433 | Electronics assembly having multiple side cooling and method | Ralph S. Taylor, Michael Jeter, Jeffrey J. Ronning | 2007-11-13 |
| 7148564 | Dual-sided substrate integrated circuit package including a leadframe having leads with increased thickness | Roger A Mock | 2006-12-12 |
| 7095098 | Electrically isolated and thermally conductive double-sided pre-packaged component | Ralph S. Taylor | 2006-08-22 |
| 6812553 | Electrically isolated and thermally conductive double-sided pre-packaged component | Ralph S. Taylor | 2004-11-02 |
| 6639798 | Automotive electronics heat exchanger | Michael Jeter, Roger A Mock, Jeffrey J. Ronning, Ralph S. Taylor, Andrew Royds Hayes | 2003-10-28 |
| 6575765 | Interconnect assembly for an electronic assembly and assembly method therefor | — | 2003-06-10 |
| 6054765 | Parallel dual switch module | Charles T. Eytcheson, Monty B. Hayes, Lisa A. Viduya, Roger A Mock, Eric Von Kierstead +2 more | 2000-04-25 |