Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7697303 | Dual-sided substrate integrated circuit package including a leadframe having leads with increased thickness | Erich W. Gerbsch | 2010-04-13 |
| 7148564 | Dual-sided substrate integrated circuit package including a leadframe having leads with increased thickness | Erich W. Gerbsch | 2006-12-12 |
| 6639798 | Automotive electronics heat exchanger | Michael Jeter, Erich W. Gerbsch, Jeffrey J. Ronning, Ralph S. Taylor, Andrew Royds Hayes | 2003-10-28 |
| 6054765 | Parallel dual switch module | Charles T. Eytcheson, Monty B. Hayes, Lisa A. Viduya, Eric Von Kierstead, Todd G. Nakanishi +2 more | 2000-04-25 |