Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6918437 | Heatsink buffer configuration | Larry Houk, Rick B. Mummert | 2005-07-19 |
| 6822331 | Method of mounting a circuit component and joint structure therefor | — | 2004-11-23 |
| 6127727 | Semiconductor substrate subassembly with alignment and stress relief features | — | 2000-10-03 |
| 6054765 | Parallel dual switch module | Monty B. Hayes, Lisa A. Viduya, Roger A Mock, Eric Von Kierstead, Todd G. Nakanishi +2 more | 2000-04-25 |
| 5895974 | Durable substrate subassembly for transistor switch module | Todd G. Nakanishi, Frank D. Lachenmaier, Michael D. Bramel | 1999-04-20 |
| 5563447 | High power semiconductor switch module | Donald E. Lake, deceased, Aiman Alhoussami | 1996-10-08 |
| 5539254 | Substrate subassembly for a transistor switch module | Donald E. Lake, deceased, Aiman Alhoussami, John Tagle, Timothy D. Martin, Lisa A. Viduya +1 more | 1996-07-23 |
| 5523620 | Coplanar linear dual switch module | Todd G. Nakanishi, Michael D. Bramel, John Tagle, Frank D. Lachenmaier | 1996-06-04 |
| 5519253 | Coaxial switch module | Donald E. Lake, deceased | 1996-05-21 |
| 5517059 | Electron and laser beam welding apparatus | Donald E. Lake, deceased, Patrick E. Tonies | 1996-05-14 |
| 5492842 | Substrate subassembly and method of making transistor switch module | Donald E. Lake, deceased, Aiman Alhoussami, John Tagle, Timothy D. Martin, Lisa A. Viduya +1 more | 1996-02-20 |
| 5444295 | Linear dual switch module | Donald E. Lake, deceased, Aiman Alhoussami | 1995-08-22 |
| 5322565 | Method and apparatus for through hole substrate printing | Joseph M. Zachman, Clyde E. Ragan, Steven L. Alexander, Bruce A. Myers | 1994-06-21 |
| 5080929 | Method and apparatus for through hole substrate printing | Joseph M. Zachman, Clyde E. Ragan, Steven L. Alexander, Bruce A. Myers | 1992-01-14 |
| 5072281 | Interconnection lead having individual spiral lead design | — | 1991-12-10 |
| 4490902 | Lead frame for molded integrated circuit package | Phillip A. Lutz, Harold L. Fields | 1985-01-01 |
| 4215360 | Power semiconductor device assembly having a lead frame with interlock members | — | 1980-07-29 |