Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6918437 | Heatsink buffer configuration | Charles T. Eytcheson, Rick B. Mummert | 2005-07-19 |
| 5373111 | Bond pad having a patterned bonding surface | Kevin E. McClure, Thomas P. Douglas | 1994-12-13 |