Issued Patents All Time
Showing 26–42 of 42 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6822018 | Thermally-conductive electrically-insulating polymer-base material | Arun K. Chaudhuri | 2004-11-23 |
| 6807731 | Method for forming an electronic assembly | Scott D. Brandenburg, Jeenhuei Tsai, Suresh K. Chengalva | 2004-10-26 |
| 6779260 | Overmolded electronic package including circuit-carrying substrate | Scott D. Brandenburg, Thomas A. Degenkolb | 2004-08-24 |
| 6703128 | Thermally-capacitive phase change encapsulant for electronic devices | Arun K. Chaudhuri, Jeffrey H. Burns | 2004-03-09 |
| 6693239 | Overmolded circuit board with underfilled surface-mount component and method therefor | Scott D. Brandenburg, Jeenhuei Tsai | 2004-02-17 |
| 6560110 | Corrosive resistant flip chip thermal management structure | Thomas A. Degenkolb, Henry M. Sanftleben, Darrel E. Peugh | 2003-05-06 |
| 6535396 | Combination circuit board and segmented conductive bus substrate | Thomas A. Degenkolb, Darrel E. Peugh | 2003-03-18 |
| 6156980 | Flip chip on circuit board with enhanced heat dissipation and method therefor | Darrel E. Peugh, Joanna Berndt | 2000-12-05 |
| 5482200 | Method for applying solder to a fine pitch flip chip pattern | Ronnie J. Runyon | 1996-01-09 |
| 5400950 | Method for controlling solder bump height for flip chip integrated circuit devices | Petrina L. Schnabel | 1995-03-28 |
| 5395679 | Ultra-thick thick films for thermal management and current carrying capabilities in hybrid circuits | Dwadasi Hare Rama Sarma, Anil K. Kollipara, Ponnusamy Palanisamy | 1995-03-07 |
| 5334422 | Electrical connector having energy-formed solder stops and methods of making and using the same | John K. Isenberg, Christine Redder Coapman, James A. Blanton | 1994-08-02 |
| 5322565 | Method and apparatus for through hole substrate printing | Joseph M. Zachman, Clyde E. Ragan, Steven L. Alexander, Charles T. Eytcheson | 1994-06-21 |
| 5281772 | Electrical connector having energy-formed solder stops and methods of making and using the same | John K. Isenberg, Christine Redder Coapman, James A. Blanton | 1994-01-25 |
| 5151777 | Interface device for thermally coupling an integrated circuit to a heat sink | Timur Akin, William M. Maki, Ponnusamy Palanisamy | 1992-09-29 |
| 5080929 | Method and apparatus for through hole substrate printing | Joseph M. Zachman, Clyde E. Ragan, Steven L. Alexander, Charles T. Eytcheson | 1992-01-14 |
| 4894015 | Flexible circuit interconnector and method of assembly thereof | David M. Stockero, Robert H. Obremski | 1990-01-16 |