Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5482200 | Method for applying solder to a fine pitch flip chip pattern | Bruce A. Myers | 1996-01-09 |
| 5438749 | Method of making a flex circuit interconnect for a microprocessor emulator and a method of testing | — | 1995-08-08 |
| 4867715 | Interconnection lead with redundant bonding regions | Norman J. Roth | 1989-09-19 |