Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9231124 | Ball grid array packaged camera device soldered to a substrate | Binghua Pan, Yew Kwang Low | 2016-01-05 |
| 7616448 | Wrap-around overmold for electronic assembly | Thomas A. Degenkolb, Scott D. Brandenburg, Larry M. Mandel, Kin Yean Chow, Ching Meng Fang | 2009-11-10 |
| 7462077 | Overmolded electronic assembly | Kin Yean Chow, Ching Meng Fang, Larry M. Mandel | 2008-12-09 |
| 7455552 | Overmolded electronic assembly with metal seal ring | Ching Meng Fang, Kin Yean Chow, Larry M. Mandel | 2008-11-25 |
| 7148554 | Discrete electronic component arrangement including anchoring, thermally conductive pad | Chih Nah, Morris D. Stillabower, Binghua Pan, Przemyslaw Gromala | 2006-12-12 |