Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9698083 | Three-dimensional stack of leaded package and electronic member | — | 2017-07-04 |
| 8603909 | Integrated circuit packaging system with core region and bond pad and method of manufacture thereof | Kai Chong Chan | 2013-12-10 |
| 8048761 | Fabricating method for crack stop structure enhancement of integrated circuit seal ring | Kai Chong Chan | 2011-11-01 |
| 7892963 | Integrated circuit packaging system and method of manufacture thereof | Kai Chong Chan | 2011-02-22 |