Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11127693 | Barrier for power metallization in semiconductor devices | Johann Gatterbauer, Katrin Albers, Klaus Goller, Norbert Mais, Marianne Kolitsch +3 more | 2021-09-21 |
| 11081384 | Method for stabilizing a semiconductor arrangement | Hermann Gruber | 2021-08-03 |
| 8765531 | Method for manufacturing a metal pad structure of a die, a method for manufacturing a bond pad of a chip, a die arrangement and a chip arrangement | Johann Gatterbauer, Bernhard Weidgans | 2014-07-01 |
| 7737560 | Metallization layer for a power semiconductor device | Matthias Stecher, Renate Hofmann | 2010-06-15 |
| 7276803 | Semiconductor component and method for fabricating | Matthias Stecher, Renate Hofmann | 2007-10-02 |