Issued Patents All Time
Showing 1–25 of 38 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12363961 | Semiconductor device | Carsten Schaeffer, Patrick HANEKAMP, Oliver Humbel, Angelika Koprowski, Francisco Javier Santos Rodriguez | 2025-07-15 |
| 12040288 | Chip package and method of forming a chip package | Harry Sax, Johann Gatterbauer, Evelyn Napetschnig, Michael Rogalli | 2024-07-16 |
| 11887894 | Methods for processing a wide band gap semiconductor wafer using a support layer and methods for forming a plurality of thin wide band gap semiconductor wafers using support layers | Francisco Javier Santos Rodriguez, Günter Denifl, Tobias Franz Wolfgang Hoechbauer, Martin Huber, Roland Rupp +1 more | 2024-01-30 |
| 11735534 | Chip package and method of forming a chip package | Harry Sax, Johann Gatterbauer, Evelyn Napetschnig, Michael Rogalli | 2023-08-22 |
| 11557505 | Method of manufacturing a template wafer | Rudolf Berger, Rudolf Lehner, Gerhard Metzger-Brueckl, Guenther Ruhl | 2023-01-17 |
| 11557506 | Methods for processing a semiconductor substrate | Werner Schustereder, Alexander Breymesser, Mihai Draghici, Tobias Franz Wolfgang Hoechbauer, Hans-Joachim Schulze +1 more | 2023-01-17 |
| 11424201 | Method of forming an aluminum oxide layer, metal surface with aluminum oxide layer, and electronic device | Michael Rogalli, Johann Gatterbauer, Kurt Matoy, Evelyn Napetschnig, Manfred Schneegans +1 more | 2022-08-23 |
| 11373863 | Method of manufacturing a silicon carbide device and wafer composite including laser modified zones in a handle substrate | Roland Rupp, Mihai Draghici, Tobias Franz Wolfgang Hoechbauer, Matteo Piccin | 2022-06-28 |
| 11328935 | Method of forming a layer structure, layer structure, method of forming a contact structure, method of forming a chip package, and chip package | Johann Gatterbauer, Norbert Mais, Verena Muhr, Edmund Riedl, Harry Sax | 2022-05-10 |
| 11107732 | Methods for processing a wide band gap semiconductor wafer, methods for forming a plurality of thin wide band gap semiconductor wafers, and wide band gap semiconductor wafers | Francisco Javier Santos Rodriguez, Guenter Denifl, Tobias Franz Wolfgang Hoechbauer, Martin Huber, Roland Rupp +1 more | 2021-08-31 |
| 10903078 | Methods for processing a silicon carbide wafer, and a silicon carbide semiconductor device | Hans-Joachim Schulze, Alexander Breymesser, Guenter Denifl, Mihai Draghici, Bernhard Goller +3 more | 2021-01-26 |
| 10784145 | Wafer composite and method for producing a semiconductor component | Rudolf Berger, Gerhard Metzger-Brueckl, Guenther Ruhl, Roland Rupp | 2020-09-22 |
| 10651072 | Wafer composite and method for producing semiconductor components | Rudolf Berger, Gerhard Metzger-Brueckl, Guenther Ruhl, Roland Rupp | 2020-05-12 |
| 10431504 | Method of manufacturing semiconductor devices by bonding a semiconductor disk on a base substrate, composite wafer and semiconductor device | Rudolf Berger, Albert Birner, Helmut Brech, Oliver Häberlen, Guenther Ruhl +1 more | 2019-10-01 |
| 10103123 | Semiconductor devices and processing methods | Michael Rogalli | 2018-10-16 |
| 10020226 | Method for forming a semiconductor device and a semiconductor device | Roland Rupp, Francisco Javier Santos Rodriguez, Hans-Joachim Schulze | 2018-07-10 |
| 9881991 | Capacitor and method of forming a capacitor | Michael Stadtmueller, Stefan Pompl, Markus Meyer | 2018-01-30 |
| 9793167 | Method for forming a wafer structure, a method for forming a semiconductor device and a wafer structure | Roland Rupp, Francisco Javier Santos Rodriguez | 2017-10-17 |
| 9704750 | Method for forming a semiconductor device and a semiconductor device | Roland Rupp, Francisco Javier Santos Rodriguez, Hans-Joachim Schulze | 2017-07-11 |
| 9590044 | Two-dimensional material containing electronic components | Guenther Ruhl, Rudolf Berger | 2017-03-07 |
| 9583559 | Capacitor having a top compressive polycrystalline plate | Stefan Pompl, Markus Meyer | 2017-02-28 |
| 9576844 | Method for manufacturing a composite wafer having a graphite core, and composite wafer having a graphite core | Rudolf Berger, Hermann Gruber, Guenther Ruhl, Raimund Foerg, Anton Mauder +5 more | 2017-02-21 |
| 9385031 | Method for providing a self-aligned pad protection in a semiconductor device | Michael Rogalli | 2016-07-05 |
| 9349804 | Composite wafer for bonding and encapsulating an SiC-based functional layer | Rudolf Berger, Hans-Joachim Schulze, Anton Mauder, Günther Ruhl, Roland Rupp | 2016-05-24 |
| 9252045 | Method for manufacturing a composite wafer having a graphite core | Rudolf Berger, Hermann Gruber, Guenther Ruhl, Raimund Foerg, Anton Mauder +1 more | 2016-02-02 |