Issued Patents All Time
Showing 25 most recent of 35 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12278275 | Selective laser annealing method | Albert Birner, Rudolf Berger, Olaf Storbeck, Haifeng Sun, John Twynam | 2025-04-15 |
| 12230689 | Semiconductor device and method for fabricating a semiconductor wafer | Albert Birner, John Twynam | 2025-02-18 |
| 12087830 | Group III nitride device and method of fabricating a Group III nitride-based device | Albert Birner, John Twynam | 2024-09-10 |
| 11929405 | Group III nitride-based transistor device having a field plate | Albert Birner, John Twynam | 2024-03-12 |
| 11869963 | Semiconductor device and method of fabricating a semiconductor device | John Twynam, Albert Birner | 2024-01-09 |
| 11817482 | Semiconductor device and method | Carsten Ahrens, Matthias Zigldrum | 2023-11-14 |
| 11581418 | Selective thermal annealing method | Albert Birner, Rudolf Berger, Olaf Storbeck, Haifeng Sun, John Twynam | 2023-02-14 |
| 11342451 | Semiconductor device and method of fabricating a semiconductor device | John Twynam, Albert Birner | 2022-05-24 |
| 11031327 | Through vias and methods of formation thereof | Albert Birner | 2021-06-08 |
| 10707818 | RF amplifier with impedance matching components monolithically integrated in transistor die | Richard Wilson | 2020-07-07 |
| 10672686 | LDMOS transistor and method | Albert Birner, Matthias Zigldrum | 2020-06-02 |
| 10665531 | LDMOS transistor | Albert Birner, Matthias Zigldrum | 2020-05-26 |
| 10629575 | Stacked die semiconductor package with electrical interposer | Thorsten Scharf, Carsten Ahrens, Martin Gruber, Thorsten Meyer, Matthias Zigldrum | 2020-04-21 |
| 10629727 | Method of manufacturing a semiconductor device including an LDMOS transistor | Albert Birner, Matthias Zigldrum, Michaela Braun, Jan Ropohl | 2020-04-21 |
| 10622284 | LDMOS transistor and method | Albert Birner, Matthias Zigldrum | 2020-04-14 |
| 10431504 | Method of manufacturing semiconductor devices by bonding a semiconductor disk on a base substrate, composite wafer and semiconductor device | Wolfgang Lehnert, Rudolf Berger, Albert Birner, Oliver Häberlen, Guenther Ruhl +1 more | 2019-10-01 |
| 10403724 | Semiconductor wafer | Albert Birner, Simone Lavanga | 2019-09-03 |
| 10340334 | Semiconductor device including an LDMOS transistor and a resurf structure | Albert Birner, Matthias Zigldrum, Michaela Braun, Christian Eckl | 2019-07-02 |
| 10304789 | LDMOS transistor structure and method of manufacture | Albert Birner, Matthias Zigldrum, Michaela Braun, Jan Ropohl | 2019-05-28 |
| 10242932 | LDMOS transistor and method | Albert Birner, Matthias Zigldrum | 2019-03-26 |
| 10134603 | Method of planarising a surface | Albert Birner | 2018-11-20 |
| 10074721 | Method of fabricating a semiconductor wafer that includes producing a planarised surface having both a mesa surface and an insulating layer surface | Albert Birner, Simone Lavanga | 2018-09-11 |
| 10050139 | Semiconductor device including a LDMOS transistor and method | Albert Birner, Matthias Zigldrum, Michaela Braun, Jan Ropohl | 2018-08-14 |
| 10026806 | Semiconductor device including an LDMOS transistor and a RESURF structure | Albert Birner, Matthias Zigldrum, Michaela Braun, Christian Eckl | 2018-07-17 |
| 10020270 | Semiconductor device including a LDMOS transistor, monolithic microwave integrated circuit and method | Albert Birner, Matthias Zigldrum, Michaela Braun, Jan Ropohl | 2018-07-10 |