Issued Patents All Time
Showing 25 most recent of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11367654 | Component and method of manufacturing a component using an ultrathin carrier | Karl Mayer, Evelyn Napetschnig, Michael Pinczolits, Michael Sternad | 2022-06-21 |
| 11282805 | Silicon carbide devices and methods for manufacturing the same | Markus Menath, Gudrun Stranzl | 2022-03-22 |
| 11195713 | Methods of forming a silicon-insulator layer and semiconductor device having the same | Joachim Hirschler, Georg Ehrentraut, Christoffer Erbert, Klaus Goeschl, Markus Heinrici +6 more | 2021-12-07 |
| 11077525 | Method of processing a silicon carbide containing crystalline substrate, silicon carbide chip, and processing chamber | Markus Menath, Gudrun Stranzl | 2021-08-03 |
| 11063014 | Semiconductor devices including a metal silicide layer and methods for manufacturing thereof | Gudrun Stranzl | 2021-07-13 |
| 10672716 | Integrated circuit substrate and method for manufacturing the same | Gudrun Stranzl, Manfred Engelhardt, Martin Zgaga | 2020-06-02 |
| 10643917 | Magnetic phase change material for heat dissipation | Christoph Bergmann | 2020-05-05 |
| 10622218 | Segmented edge protection shield | Manfred Engelhardt, Georg Ehrentraut | 2020-04-14 |
| 10373868 | Method of processing a porous conductive structure in connection to an electronic component on a substrate | Martin Mischitz, Markus Heinrici, Oliver Hellmund, Caterina Travan, Manfred Schneegans +2 more | 2019-08-06 |
| 10186458 | Component and method of manufacturing a component using an ultrathin carrier | Karl Mayer, Evelyn Napetschnig, Michael Pinczolits, Michael Sternad | 2019-01-22 |
| 10157765 | Methods for processing a semiconductor workpiece | Gudrun Stranzl, Martin Zgaga, Rainer Leuschner, Bernhard Goller, Bernhard Boche +5 more | 2018-12-18 |
| 10032670 | Plasma dicing of silicon carbide | Manfred Engelhardt, Gudrun Stranzl | 2018-07-24 |
| 10020264 | Integrated circuit substrate and method for manufacturing the same | Gudrun Stranzl, Manfred Engelhardt, Martin Zgaga | 2018-07-10 |
| 10005659 | Method for simultaneous structuring and chip singulation | Thomas Grille, Ursula Hedenig, Gudrun Stranzl, Martin Zgaga | 2018-06-26 |
| 9911686 | Source down semiconductor devices and methods of formation thereof | Manfred Schneegans, Andreas Meiser, Martin Mischitz, Michael Pinczolits | 2018-03-06 |
| 9793129 | Segmented edge protection shield | Manfred Engelhardt, Georg Ehrentraut | 2017-10-17 |
| 9704748 | Method of dicing a wafer | Joerg Ortner, Gudrun Stranzl, Rudolf Rothmaler | 2017-07-11 |
| 9673096 | Method for processing a semiconductor substrate and a method for processing a semiconductor wafer | Joachim Hirschler, Markus Heinrici, Gudrun Stranzl, Martin Mischitz, Martin Zgaga | 2017-06-06 |
| 9640419 | Carrier system for processing semiconductor substrates, and methods thereof | Manfred Schneegans, Martin Mischitz, Michael Pinczolits | 2017-05-02 |
| 9610543 | Method for simultaneous structuring and chip singulation | Thomas Grille, Ursula Hedenig, Gudrun Stranzl, Martin Zgaga | 2017-04-04 |
| 9496193 | Semiconductor chip with structured sidewalls | Gudrun Stranzl, Martin Zgaga, Martin Sporn, Tobias Schmidt | 2016-11-15 |
| 9455192 | Kerf preparation for backside metallization | Manfred Engelhardt, Johann Schmid, Gudrun Stranzl, Joachim Hirschler | 2016-09-27 |
| 9449876 | Singulation of semiconductor dies with contact metallization by electrical discharge machining | Gudrun Stranzl, Manfred Schneegans | 2016-09-20 |
| 9368436 | Source down semiconductor devices and methods of formation thereof | Manfred Schneegans, Andreas Meiser, Martin Mischitz, Michael Pinczolits | 2016-06-14 |
| 9059273 | Methods for processing a semiconductor wafer | Petra Fischer, Gudrun Stranzl | 2015-06-16 |