Issued Patents All Time
Showing 1–25 of 26 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11282805 | Silicon carbide devices and methods for manufacturing the same | Michael Roesner, Markus Menath | 2022-03-22 |
| 11077525 | Method of processing a silicon carbide containing crystalline substrate, silicon carbide chip, and processing chamber | Michael Roesner, Markus Menath | 2021-08-03 |
| 11063014 | Semiconductor devices including a metal silicide layer and methods for manufacturing thereof | Michael Roesner | 2021-07-13 |
| 10672716 | Integrated circuit substrate and method for manufacturing the same | Michael Roesner, Manfred Engelhardt, Martin Zgaga | 2020-06-02 |
| 10157765 | Methods for processing a semiconductor workpiece | Martin Zgaga, Rainer Leuschner, Bernhard Goller, Bernhard Boche, Manfred Engelhardt +5 more | 2018-12-18 |
| 10032670 | Plasma dicing of silicon carbide | Michael Roesner, Manfred Engelhardt | 2018-07-24 |
| 10020264 | Integrated circuit substrate and method for manufacturing the same | Michael Roesner, Manfred Engelhardt, Martin Zgaga | 2018-07-10 |
| 10005659 | Method for simultaneous structuring and chip singulation | Thomas Grille, Ursula Hedenig, Michael Roesner, Martin Zgaga | 2018-06-26 |
| 9966277 | Arrangement and method for manufacturing the same | Markus Zundel, Andre Schmenn, Damian Sojka, Isabella Goetz, Sebastian Werner +3 more | 2018-05-08 |
| 9741618 | Methods of forming semiconductor devices | Martin Zgaga, Markus Kahn, Guenter Denifl | 2017-08-22 |
| 9704748 | Method of dicing a wafer | Joerg Ortner, Michael Roesner, Rudolf Rothmaler | 2017-07-11 |
| 9673096 | Method for processing a semiconductor substrate and a method for processing a semiconductor wafer | Joachim Hirschler, Michael Roesner, Markus Heinrici, Martin Mischitz, Martin Zgaga | 2017-06-06 |
| 9610543 | Method for simultaneous structuring and chip singulation | Thomas Grille, Ursula Hedenig, Michael Roesner, Martin Zgaga | 2017-04-04 |
| 9496193 | Semiconductor chip with structured sidewalls | Michael Roesner, Martin Zgaga, Martin Sporn, Tobias Schmidt | 2016-11-15 |
| 9490103 | Separation of chips on a substrate | Manfred Engelhardt, Markus Zundel, Hubert Maier | 2016-11-08 |
| 9455192 | Kerf preparation for backside metallization | Michael Roesner, Manfred Engelhardt, Johann Schmid, Joachim Hirschler | 2016-09-27 |
| 9449876 | Singulation of semiconductor dies with contact metallization by electrical discharge machining | Michael Roesner, Manfred Schneegans | 2016-09-20 |
| 9449928 | Layer arrangement | Joachim Hirschler | 2016-09-20 |
| 9293371 | Method for processing a semiconductor workpiece with metallization | Anja Reitmeier, Hermann Wendt, Thomas Fischer, Bernhard Weidgans, Tobias Schmidt +1 more | 2016-03-22 |
| 9257342 | Methods of singulating substrates to form semiconductor devices using dummy material | Martin Zgaga, Markus Kahn, Guenter Denifl | 2016-02-09 |
| 9219011 | Separation of chips on a substrate | Manfred Engelhardt, Markus Zundel, Hubert Maier | 2015-12-22 |
| 9093385 | Method for processing a semiconductor workpiece with metallization | Anja Gissibl, Hermann Wendt, Thomas Fischer, Bernhard Weidgans, Tobias Schmidt +1 more | 2015-07-28 |
| 9059273 | Methods for processing a semiconductor wafer | Petra Fischer, Michael Roesner | 2015-06-16 |
| 8772133 | Utilization of a metallization scheme as an etching mask | Manfred Engelhardt, Martin Zgaga, Karl Mayer | 2014-07-08 |
| 8748297 | Methods of forming semiconductor devices by singulating a substrate by removing a dummy fill material | Martin Zgaga, Markus Kahn, Guenter Denifl | 2014-06-10 |