Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183696 | Semiconductor device including bonding pad metal layer structure | Evelyn Napetschnig, Jens Brandenburg, Christoffer Erbert, Oliver Humbel, Thomas Rupp +2 more | 2024-12-31 |
| 11764176 | Semiconductor device including bonding pad metal layer structure | Evelyn Napetschnig, Jens Brandenburg, Christoffer Erbert, Oliver Humbel, Thomas Rupp +2 more | 2023-09-19 |
| 11195713 | Methods of forming a silicon-insulator layer and semiconductor device having the same | Georg Ehrentraut, Christoffer Erbert, Klaus Goeschl, Markus Heinrici, Michael Hutzler +6 more | 2021-12-07 |
| 10453806 | Methods for forming semiconductor devices and semiconductor device | Christoffer Erbert, Markus Heinrici, Mathias Plappert, Caterina Travan | 2019-10-22 |
| 10195704 | Lift pin for substrate processing | Christian Himmelsbach, Helmut Brunner | 2019-02-05 |
| 10170746 | Battery electrode, battery, and method for manufacturing a battery electrode | Magdalena Forster, Michael Sorger, Katharina Schmut, Bernhard Goller, Philemon Schweizer +2 more | 2019-01-01 |
| 9905147 | Display device | Johann Schmid | 2018-02-27 |
| 9673096 | Method for processing a semiconductor substrate and a method for processing a semiconductor wafer | Michael Roesner, Markus Heinrici, Gudrun Stranzl, Martin Mischitz, Martin Zgaga | 2017-06-06 |
| 9614045 | Method of processing a semiconductor device and chip package | Srinivasa Reddy Yeduru, Harald Wiedenhofer, Franz Kleinbichler | 2017-04-04 |
| 9511560 | Processing a sacrificial material during manufacture of a microfabricated product | Guenter Denifl, Daniel Maurer, Thomas Grille, Markus Kahn | 2016-12-06 |
| 9455192 | Kerf preparation for backside metallization | Michael Roesner, Manfred Engelhardt, Johann Schmid, Gudrun Stranzl | 2016-09-27 |
| 9449928 | Layer arrangement | Gudrun Stranzl | 2016-09-20 |
| 9135893 | Display device | Johann Schmid | 2015-09-15 |
| 8815706 | Methods of forming semiconductor devices | Michael Roesner, Manfred Engelhardt | 2014-08-26 |
| 8748307 | Use of a protection layer to protect a passivation while etching a wafer | Gudrun Stranzl | 2014-06-10 |